參數(shù)資料
型號(hào)： 24850
英文描述： Parasite-Power Digital Thermometer
中文描述： Socket 754的設(shè)計(jì)和資格要求
文件頁數(shù)： 27/40頁
文件大?。?/td> 2405K
代理商： 24850
24850 Rev. 3.07 August 2003
Socket 754 Design and Qualification Requirements
Table 2. Mechanical Qualification Test Procedures (Continued)
Test Procedure
Test Condition
Requirements
Pin Current Rating
EIA 364-70 Method 2
330 contacts must be in series.
Thermocouple to be placed under
socket 754 between pins (P22, P23,
R22, and R23)
During testing 12 V power must be
supplied to the fan.
Generate graph Temperature Rise
vs. Current
1.2 Amp per pin at T – rise of 20°C
maximum
Continue testing until delta T – rise
is 30°C.
Thermal Cycling Life
EIA 364-32
No physical damage
LLCR 20.0 m
max. per contact
over 336 contacts (168 pin pairs).
LLCR to be measured each 250
cycles until failure
Sample size 25 minimum
A socket has failed if one contact
exceeds the 20.0 m
maximum
Temperature cycle with the
retention mechanism load applied,
then remove the applied load for
each LLCR measurement.
LLCR measurements recorded until
60% of the sockets have a failure or
3000 cycles completed
–55°C to 110°C, (temperature ±
5°C solder ball temperature
1000 cycles minimum with no
failures
Maximum of 2 cycles per hour
Once the solder ball junction
reaches the temperature specified,
soak for 5 minutes.
The chamber temperature may be
raised or lowered to speed the
temperature change at the solder
ball.
All samples must be mated during
testing.
Chapter 6
Mechanical Test Procedure Conditions and Requirements
27
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