參數(shù)資料
型號： ADSP-21369KSWZ-5A
廠商： Analog Devices Inc
文件頁數(shù)： 49/64頁
文件大?。?/td> 0K
描述： IC DSP 32BIT 366MHZ 208LQFP
標(biāo)準(zhǔn)包裝： 1
系列： SHARC®
類型： 浮點(diǎn)
接口： DAI，DPI
時(shí)鐘速率： 366MHz
非易失內(nèi)存： ROM（768 kB）
芯片上RAM： 256kB
電壓 - 輸入/輸出： 3.30V
電壓 - 核心： 1.20V
工作溫度： 0°C ~ 70°C
安裝類型： 表面貼裝
封裝/外殼： 208-LQFP 裸露焊盤
供應(yīng)商設(shè)備封裝： 208-LQFP-EP（28x28）
包裝： 托盤
Rev. F
|
Page 53 of 64
|
October 2013
THERMAL CHARACTERISTICS
The ADSP-21367/ADSP-21368/ADSP-21369 processors are
rated for performance over the temperature range specified in
Table 43 and Table 44 airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6 and the junction-to-
board measurement complies with JESD51-8. Test board design
complies with JEDEC standards JESD51-9 (BGA_ED) and
JESD51-8 (LQFP_EP). The junction-to-case measurement com-
plies with MIL-STD-883. All measurements use a 2S2P JEDEC
test board.
The LQFP-EP package requires thermal trace squares and ther-
mal vias, to an embedded ground plane, in the PCB. Refer to
JEDEC standard JESD51-5 for more information.
To determine the junction temperature of the device while on
the application PCB, use:
where:
TJ = junction temperature (C)
TTOP = case temperature (C) measured at the top center of the
package
JT = junction-to-top (of package) characterization parameter is
the typical value from Table 43 and Table 44.
PD = power dissipation (see Engineer-to-Engineer Note EE-299)
Values of
JA are provided for package comparison and PCB
design considerations. JA can be used for a first-order approxi-
mation of TJ by the equation:
where:
TA = ambient temperature (C)
Values of
JC are provided for package comparison and PCB
design considerations when an external heat sink is required.
This is only applicable when a heat sink is used.
Values of
JB are provided for package comparison and PCB
design considerations. The thermal characteristics values pro-
vided in Table 43 and Table 44 are modeled values @ 2 W.
Figure 47. Typical Output Delay or Hold vs. Load Capacitance
(at Junction Temperature)
Figure 48. SDCLK Typical Output Delay or Hold vs. Load Capacitance
(at Junction Temperature)
LOAD CAPACITANCE (pF)
0
200
50
100
150
10
8
O
U
T
P
U
T
D
E
L
A
Y
O
R
H
O
L
D
(n
s
)
-
4
6
0
4
2
-
2
y = 0.0488x - 1.5923
LOAD CAPACITANCE (pF)
6
-
2
0100
2
0
8
4
R
IS
E
A
N
D
F
A
L
T
IM
E
S
(n
s
)
200
150
50
y = 0.0256x - 0.021
Table 43. Thermal Characteristics for 256-Ball BGA_ED
Parameter
Condition
Typical
Unit
JA
Airflow = 0 m/s
12.5
C/W
JMA
Airflow = 1 m/s
10.6
C/W
JMA
Airflow = 2 m/s
9.9
C/W
JC
0.7
C/W
JB
5.3
C/W
JT
Airflow = 0 m/s
0.3
C/W
JMT
Airflow = 1 m/s
0.3
C/W
JMT
Airflow = 2 m/s
0.3
C/W
Table 44. Thermal Characteristics for 208-Lead LQFP EPAD
(With Exposed Pad Soldered to PCB)
Parameter
Condition
Typical
Unit
JA
Airflow = 0 m/s
17.1
C/W
JMA
Airflow = 1 m/s
14.7
C/W
JMA
Airflow = 2 m/s
14.0
C/W
JC
9.6
C/W
JT
Airflow = 0 m/s
0.23
C/W
JMT
Airflow = 1 m/s
0.39
C/W
JMT
Airflow = 2 m/s
0.45
C/W
JB
Airflow = 0 m/s
11.5
C/W
JMB
Airflow = 1 m/s
11.2
C/W
JMB
Airflow = 2 m/s
11.0
C/W
TJ
TTOP
JT
PD
+
=
TJ
TA
JA
PD
+
=
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