參數(shù)資料
型號(hào): CY7C1515AV18-250BZXI
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: SRAM
英文描述: 2M X 36 QDR SRAM, 0.45 ns, PBGA165
封裝: 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
文件頁(yè)數(shù): 17/31頁(yè)
文件大?。?/td> 774K
代理商: CY7C1515AV18-250BZXI
CY7C1511AV18, CY7C1526AV18
CY7C1513AV18, CY7C1515AV18
Document Number: 001-06985 Rev. *D
Page 24 of 31
Switching Characteristics
Over the Operating Range [22, 23]
Cypress
Parameter
Consortium
Parameter
Description
300 MHz
278 MHz
250 MHz
200 MHz
167 MHz
Unit
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
tPOWER
VDD(Typical) to the First Access
111
11
ms
tCYC
tKHKH
K Clock and C Clock Cycle Time
3.3
8.4
3.6
8.4
4.0
8.4
5.0
8.4
6.0
8.4
ns
tKH
tKHKL
Input Clock (K/K; C/C) HIGH
1.32
1.4
1.6
2.0
2.4
ns
tKL
tKLKH
Input Clock (K/K; C/C) LOW
1.32
1.4
1.6
2.0
2.4
ns
tKHKH
K Clock Rise to K Clock Rise and C
to C Rise (rising edge to rising edge)
1.49
1.6
1.8
2.2
2.7
ns
tKHCH
K/K Clock Rise to C/C Clock Rise
(rising edge to rising edge)
0
1.45
0
1.55
0
1.802.202.7
ns
Setup Times
tSA
tAVKH
Address Setup to K Clock Rise
0.4
0.4
0.5
0.6
0.7
ns
tSC
tIVKH
Control Setup to K Clock Rise
(RPS, WPS)
0.4
0.4
0.5
0.6
0.7
ns
tSCDDR
tIVKH
Double Data Rate Control Setup to
Clock (K/K) Rise
(BWS0, BWS1, BWS2, BWS3)
0.3
0.3
0.35
0.4
0.5
ns
tSD
tDVKH
D[X:0] Setup to Clock (K/K) Rise
0.3
0.3
0.35
0.4
0.5
ns
Hold Times
tHA
tKHAX
Address Hold after K Clock Rise
0.4
0.4
0.5
0.6
0.7
ns
tHC
tKHIX
Control Hold after K Clock Rise
(RPS, WPS)
0.4
0.4
0.5
0.6
0.7
ns
tHCDDR
tKHIX
Double Data Rate Control Hold after
Clock (K/K) Rise
(BWS0, BWS1, BWS2, BWS3)
0.3
0.3
0.35
0.4
0.5
ns
tHD
tKHDX
D[X:0] Hold after Clock (K/K) Rise
0.3
0.3
0.35
0.4
0.5
ns
Notes
23. When a part with a maximum frequency above 167 MHz is operating at a lower clock frequency, it requires the input timings of the frequency range in which it is being
operated and outputs data with the output timings of that frequency range.
24. This part has a voltage regulator internally; tPOWER is the time that the power must be supplied above VDD minimum initially before a read or write operation can be
initiated.
25. For D0 data signal on CY7C1526AV18 device, tSD is 0.5 ns for 200 MHz, 250 MHz, 278 MHz and 300 MHz frequencies.
相關(guān)PDF資料
PDF描述
CY7C1522JV18-250BZI 8M X 8 DDR SRAM, 0.45 ns, PBGA165
CY7C1524KV18-333BZI 2M X 36 DDR SRAM, 0.45 ns, PBGA165
CY7C1612KV18-333BZXC 8M X 18 QDR SRAM, PBGA165
CY7C256-45PC 32K X 8 OTPROM, 45 ns, PDIP28
CY7C2561KV18-450BZC 8M X 8 QDR SRAM, 0.37 ns, PBGA165
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1515JV18-167BZI 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 2Mx36 1.8V QDR Burst 4 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1515JV18-300BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 2M x 36 1.8V QDR 靜態(tài)隨機(jī)存取存儲(chǔ)器 Four-Word Burst RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1515JV18-300BZI 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 2Mx36 1.8V QDR Burst 4 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1515JV18-300BZXC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 2M x 36 1.8V QDR 靜態(tài)隨機(jī)存取存儲(chǔ)器 Four-Word Burst RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1515JV18-333BZXC 制造商:Cypress Semiconductor 功能描述:IC SRAM 72MBIT 333MHZ 165-FPBGA - Trays