參數(shù)資料
型號(hào)： Embedded Pentium Processor
廠商： Intel Corp.
英文描述： 32 Bit Embedded Pentium Processor with Voltage Reduction Technology(32位嵌入式帶壓降技術(shù)奔騰處理器)
中文描述： 32位嵌入式電壓還原技術(shù)奔騰處理器（32位嵌入式帶壓降技術(shù)奔騰處理器）
文件頁(yè)數(shù)： 26/44頁(yè)
文件大?。?/td> 826K
代理商： EMBEDDED PENTIUM PROCESSOR
Embedded Pentium
Processor with Voltage Reduction Technology
26
Datasheet
3.4
Thermal Specifications
The SPGA embedded Pentium processor with voltage reduction technology is specified for proper
operation when the case temperature, T
CASE
(T
C
), is within the specified range of 0° C to 85° C.
The power dissipation specification in Table 11 is provided for designing thermal solutions for
operation at a sustained maximum level. This is the worst-case power the device would dissipate in
a system for a sustained period of time. This number is provided to assist in the design of a thermal
solution for the device.
3.4.1
Measuring Thermal Values
To verify that the proper case temperature (T
C
) is maintained for the embedded Pentium processor
with voltage reduction technology, it should be measured at the center of the package top surface
(encapsulant). To minimize any measurement errors, the following techniques are recommended:
Use 36 gauge or finer diameter K, T, or J type thermocouples. Intel’s laboratory testing was
done using a thermocouple made by Omega (part number: 5TC-TTK-36-36).
Attach the thermocouple bead or junction to the center of the package top surface using highly
thermally conductive cements. Intel’s laboratory testing was done by using Omega Bond (part
number: OB-100).
Attach the thermocouple at a 90
°
angle as shown in Figure 5.
Table 11. Power Dissipation Requirements for Thermal Solution Design
Parameter
Typical
1
Max
2
Unit
Notes
Active Power Dissipation
3.0–4.0
7.9
Watts
Stop Grant and Auto Halt Powerdown Power Dissipation
1.3
Watts
Note 3
Stop Clock Power Dissipation
0.02
0.05
Watts
Note 4
NOTES:
1. This is the typical power dissipation in a system. This value was the average value measured in a system
using a typical device at V
CC2
= 3.1 V and V
CC3
= 3.3 V running typical applications. This value is highly
dependent upon the specific system configuration.
2. Systems must be designed to thermally dissipate the maximum Active Power Dissipation. It is determined
using a worst-case instruction mix with V
CC2
= 3.1 V and V
CC3
= 3.3 V. The use of nominal V
CC
in this
measurement takes into account the thermal time constant of the package.
3. Stop Grant/Auto Halt Powerdown Power Dissipation is determined by asserting the STPCLK# pin or
executing the HALT instruction.
4. Stop Clock Power Dissipation is determined by asserting the STPCLK# pin and then removing the
external CLK input.
Figure 5. Technique for Measuring Case Temperature (T
C
)
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