參數(shù)資料
型號: Embedded Pentium 266
廠商: Intel Corp.
英文描述: Low-Power Embedded Pentium Processor with MMX Technology(低能量嵌入式帶MMX技術(shù)奔騰處理器)
中文描述: 低功耗嵌入式處理器奔騰MMX技術(shù)(低能量嵌入式帶MMX公司的技術(shù)奔騰處理器)
文件頁數(shù): 59/62頁
文件大小: 1130K
代理商: EMBEDDED PENTIUM 266
Low-Power Embedded Pentium
Processor with MMX Technology
Advance Information Datasheet
59
4.5.3
Ringback
Excessive ringback can contribute to long-term reliability degradation of the low-power embedded
Pentium processor with MMX technology, and can cause false signal detection. Ringback is
simulated at the input pin of a component using the input buffer model. Ringback can be simulated
with or without the diodes that are in the input buffer model.
Ringback is the absolute value of the maximum voltage at the receiving pin below V
CC3
(or above
V
SS
) relative to the V
CC3
(or V
SS
) level after the signal has reached its maximum voltage level.
The input diodes are assumed present.
If simulated without the input diodes, follow the Maximum Overshoot/Undershoot specifications.
By meeting the overshoot/undershoot specifications, the signal is guaranteed not to ringback
excessively.
If simulated with the diodes present in the input model, follow the maximum ringback
specification. The maximum ringback specification for inputs to the low-power embedded Pentium
processor with MMX technology is described as follows:
Maximum ringback specification: The maximum ringback of inputs associated with their high
states (overshoot) must not drop below V
CC3
–1.0 V as shown in Figure 24. Similarly, the
maximum ringback of inputs associated with their low states (undershoot) must not exceed
0.5 V as shown in Figure 25.
Overshoot (undershoot) is the absolute value of the maximum voltage above V
CC
(below
V
SS
). The guideline assumes the absence of diodes on the input.
Figure 23. Maximum Undershoot Level, Undershoot Threshold Level
and Undershoot Threshold Duration
000273
Maximum Undershoot Level
Undershoot Threshold Level
V , Nominal
Undershoot
Threshold
Duration
相關(guān)PDF資料
PDF描述
EMBMOD133 Intel Embedded Processor Module(英特爾嵌入式微處理器模塊)
EMBMOD166 Intel Embedded Processor Module()
EMC2DXV5T1 Dual Common Base-Collector Bias Resistor Transistors
EMC2DXV5T5 Dual Common Base-Collector Bias Resistor Transistors
EMC5DXV5T1 Dual Common Base-Collector Bias Resistor Transistors
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EMBER ZIGBEE DEV KIT W/PCWH 制造商:Custom Computer Services (CCS) 功能描述:KIT DEV EMBER ZIGBEE W/PCWH
EMB-ET850-22 制造商:IBase Technology (USA) Inc. 功能描述:ET850 COM-E AMD N54L (2.2G) V/L - Bulk
EM-BFG11905-NJ 功能描述:900MHZ FIBERGLASS BASESTATION AN 制造商:nearson inc. 系列:- 包裝:散裝 零件狀態(tài):在售 頻率組:UHF(300 MHz ~ 1 GHz) 頻率(中心/帶):915MHz 頻率范圍:902MHz ~ 928MHz 天線類型:鞭狀,直形 頻帶數(shù):1 VSWR:1.5 回波損耗:- 增益:5dBi 功率 - 最大值:100W 特性:- 端接:連接器,N 母型 侵入防護(hù):IP66 安裝類型:連接器安裝 高度(最大值):20.669"(525.00mm) 應(yīng)用:- 標(biāo)準(zhǔn)包裝:1
EMB-FTP-T-TM4C129-21P 制造商:InterNiche Technologies 功能描述:EMBFTP (SERVER) - Virtual or Non-Physical Inventory (Software & Literature)
EMBFTP-T-TM4C129-21P 制造商:InterNiche Technologies 功能描述:EMBTCP - Virtual or Non-Physical Inventory (Software & Literature)