參數(shù)資料
型號: HYB39S256800
廠商: SIEMENS AG
英文描述: 256 MBit Synchronous DRAM(256M位同步動(dòng)態(tài)RAM)
中文描述: 256兆比特同步DRAM(256M位同步動(dòng)態(tài)RAM)的
文件頁數(shù): 1/46頁
文件大?。?/td> 594K
代理商: HYB39S256800
INFINEON Technologies
1
4.99
HYB39S256400/800/160T
256MBit Synchronous DRAM
256 MBit Synchronous DRAM
Preliminary Information
The HYB39S256400/800/160T are four bank Synchronous DRAM’s organized as 4 banks x 16MBit
x4, 4 banks x 8MBit x8 and 4 banks x 4Mbit x16 respectively. These synchronous devices achieve
high speed data transfer rates for CAS-latencies by employing a chip architecture that prefetches
multiple bits and then synchronizes the output data to a system clock. The chip is fabricated with
INFINEON’s advanced 256MBit DRAM process technology.
The device is designed to comply with all industry standards set for synchronous DRAM products,
both electrically and mechanically. All of the control, address, data input and output circuits are
synchronized with the positive edge of an externally supplied clock.
Operating the four memory banks in an interleave fashion allows random access operation to occur
at higher rate than is possible with standard DRAMs. A sequential and gapless data rate of is
possible depending on burst length, CAS latency and speed grade of the device.
Auto Refresh (CBR) and Self Refresh operation are supported. These devices operates with a
single 3.3V +/- 0.3V power supply and are available in TSOPII packages.
High Performance:
Fully Synchronous to Positive Clock Edge
0 to 70
°
C operating temperature
Four Banks controlled by BA0 & BA1
Programmable CAS Latency: 2, 3, 4
Programmable Wrap Sequence: Sequential
or Interleave
Programmable Burst Length:
1, 2, 4, 8
-8
-8A
-8B
Units
fCK
125
125
100
MHz
tCK3
8
8
10
ns
tAC3
6
6
6
ns
tCK2
10
12
15
ns
tAC2
6
6
7
ns
Multiple Burst Read with Single Write
Operation
Automatic
and
Controlled
Command
Data Mask for Read / Write control (x4, x8)
Data Mask for byte control (x16)
Auto Refresh (CBR) and Self Refresh
Suspend Mode and Power Down Mode
8192 refresh cycles / 64 ms (7,8
μ
s)
Random Column Address every CLK
( 1-N Rule)
Single 3.3V +/- 0.3V Power Supply
LVTTL Interface versions
Plastic Packages:
P-TSOPII-54 400mil width (x4, x8, x16)
-8 parts for PC100 2-2-2 operation
-8A parts for PC100 3-2-2 operation
-8B parts for PC100 3-2-3 operation
Precharge
相關(guān)PDF資料
PDF描述
HYB39S256400DC-6 256 MBit Synchronous DRAM
HYB39S256400DC-7 256 MBit Synchronous DRAM
HYB39S256400DC-75 Polypropylene metallized tape wrap and epoxy filled - Snubber
HYB39S256400DC-8 256 MBit Synchronous DRAM
HYB39S256400DCL-7 256 MBit Synchronous DRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HYB39S256800AT-7.5 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x8 SDRAM
HYB39S256800AT-8 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x8 SDRAM
HYB39S256800AT-8A 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x8 SDRAM
HYB39S256800AT-8B 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x8 SDRAM
HYB39S256800CT-7.5 制造商:未知廠家 制造商全稱:未知廠家 功能描述:?256Mb (32M x 8) PC133 3-3-3?