參數(shù)資料
型號(hào)： KMC8610VT1333JB
廠商： Freescale Semiconductor
文件頁數(shù)： 14/96頁
文件大小： 0K
描述： IC HOST PROCESS 1333MHZ 783-PBGA
標(biāo)準(zhǔn)包裝： 1
系列： MPC86xx
處理器類型： 32-位 MPC86xx PowerPC
速度： 1.333GHz
電壓： 1.025V
安裝類型： 表面貼裝
封裝/外殼： 783-BBGA，F(xiàn)CBGA
供應(yīng)商設(shè)備封裝： 783-FCPBGA（29x29）
包裝： 托盤
Electrical Characteristics
MPC8610 Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
21
2.3
Power Characteristics
The power dissipation for the MPC8610 device is shown in Table 5.
The estimated maximum power dissipation for individual power supplies of the MPC8610 is shown in Table 6.
Table 5. MPC8610 Power Dissipation
Power Mode
Core/Platform
Frequency
(MHz)
VDD_Core,
VDD_PLAT
(V)
Junction
Temperature
(°C)
Power
(Watts)
Notes
Typical
1333/533
1.025
65
10.7
1, 2
Thermal
105
12.1
1, 3
Maximum
16
1, 4
Typical
1066/533
1.00
65
8.4
1, 2
Thermal
105
9.8
1, 3
Maximum
13
1, 4
Typical
800/400
1.00
65
5.8
1, 2
Thermal
105
7.2
1, 3
Maximum
9.5
1, 4
Notes:
1. These values specify the power consumption at nominal voltage and apply to all valid processor bus frequencies and
configurations. The values do not include power dissipation for I/O supplies.
2. Typical power is an average value measured at the nominal recommended core voltage (VDD_Core) and 65°C junction
temperature (see Table 3) while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz with the core
at 100% efficiency. This parameter is not 100% tested but periodically sampled.
3. Thermal power is the average power measured at nominal core voltage (VDD_Core) and maximum operating junction
temperature (see Table 3) while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz on the core
and a typical workload on platform interfaces. This parameter is not 100% tested but periodically sampled.
4. Maximum power is the maximum power measured at nominal core voltage (VDD_Core) and maximum operating junction
temperature (see Table 3) while running a test which includes an entirely L1-cache-resident, contrived sequence of
instructions which keep all the execution units maximally busy on the core.
Table 6. MPC8610 Individual Supply Maximum Power Dissipation1
Component Description
Supply Voltage
(V)
Est. Power
(Watts)
Notes
Core voltage supply
VDD_Core = 1.025 V @ 1333 MHz
14.0
VDD_Core = 1.00 V @ 1066 MHz
12.0
Core PLL voltage supply
AVDD_Core = 1.025 V @ 1333 MHz
0.0125
AVDD_Core = 1.00 V @ 1066 MHz
0.0125
Platform source supply
VDD_PLAT = 1.025 V @ 1333 MHz
4.5
VDD_PLAT = 1.00 V @ 1066 MHz
4.3
相關(guān)PDF資料
PDF描述
ACB105DHAR CONN EDGECARD 210PS R/A .050 DIP
FMC28DREN-S734 CONN EDGECARD 56POS .100 EYELET
XC4025E-2HQ304C IC FPGA C-TEMP 5V 2SPD 304-HQFP
XC4020XL-3PQ240I IC FPGA I-TEMP 3.3V 3SPD 240PQFP
XC4020XL-3PQ240C IC FPGA C-TEMP 3.3V 3SPD 240PQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
KMC8640DHX1250HC 功能描述:微處理器 - MPU G8, REV2.1, 1.05V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMC8641DHX1333JC 功能描述:微處理器 - MPU G8, REV2.1, 1.05V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMC8641DHX1500KC 功能描述:微處理器 - MPU G8, REV2.1, 1.1V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMC908AB32CFU 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Motorola Inc 功能描述: 制造商:MOTOROLA 功能描述:
KMC908AB32MFU 制造商:Rochester Electronics LLC 功能描述:- Bulk
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*