參數(shù)資料
型號： MCIMX537CVV8C
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 800 MHz, RISC PROCESSOR, PBGA529
封裝： 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, TEPBGA-529
文件頁數(shù)： 79/172頁
文件大?。?/td> 4562K
代理商： MCIMX537CVV8C
Electrical Characteristics
i.MX53 Applications Processors for Industrial Products, Rev. 3
Freescale Semiconductor
17
4.1.2
Thermal Resistance
4.1.2.1
TEPBGA-2 Package Thermal Resistance
Table 5 provides the TEPBGA-2 package thermal resistance data.
Table 5. TEPBGA-2 Package Thermal Resistance Data
Rating
Board
Symbol
Value
Unit
Junction to Ambient (natural convection)1, 2
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2 Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
Single layer board
(1s)
RθJA
28
°C/W
Junction to Ambient (natural convection)1, 2, 3
3 Per JEDEC JESD51-6 with the board horizontal.
Four layer board
(2s2p)
RθJA
16
°C/W
Junction to Ambient (at 200 ft/min)1, 3
Single layer board
(1s)
RθJMA
21
°C/W
Junction to Ambient (at 200 ft/min)1, 3
Four layer board
(2s2p)
RθJMA
13
°C/W
Junction to Board4
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
—RθJB
6°C/W
Junction to Case5
5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
—RθJC
4°C/W
Junction to Package Top (natural convection)6
6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
—
Ψ
JT
4°C/W
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCIMX537CVV8C 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 800 MHZ 529-BGA
MCIMX537CVV8CR2 功能描述:處理器 - 專門應(yīng)用 iMX53 Rev 2.1 Indust RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX538DZK1C 功能描述:處理器 - 專門應(yīng)用 I.MX53 2.1 POP RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX53EVK 制造商:Freescale Semiconductor 功能描述:
MCIMX53-LVDS 制造商:Freescale Semiconductor 功能描述:I.MX53 XGA DISPLAY LVDS DEV BOARD 制造商:Freescale Semiconductor 功能描述:I.MX53, XGA DISPLAY, LVDS, DEV BOARD 制造商:Freescale Semiconductor 功能描述:I.MX53, XGA DISPLAY, LVDS CONNECTOR, DEV BOARD; Silicon Manufacturer:Freescale; Core Architecture:ARM; Core Sub-Architecture:Cortex-A8; Silicon Core Number:i.MX5; Silicon Family Name:i.MX53
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