參數(shù)資料
型號: MPC5200
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: Hardware Specifications
中文描述: 硬件規(guī)格
文件頁數(shù): 65/80頁
文件大?。?/td> 790K
代理商: MPC5200
Package Description
MPC5200 Data Sheet, Rev. 4
Freescale Semiconductor
65
Figure 51. Mechanical Dimensions and Pinout Assignments for the MPC5200, 272 TE-PBGA
CASE 1135A–01
ISSUE B
DATE 10/15/1997
C
B
DIM
A
A1
A2
A3
b
D
D1
D2
E
E1
E2
e
MIN
2.05
0.50
0.50
1.05
0.60
27.00 BSC
24.13 REF
23.30
27.00 BSC
24.13 REF
23.30
1.27 BSC
MAX
2.65
0.70
0.70
1.25
0.90
MILLIMETERS
24.70
24.70
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER PARALLEL TO
PRIMARY DATUM A.
4. PRIMARY DATUM A AND THE SEATING PLANE
ARE DEFINED BY THE SPHERICAL CROWNS OF
THE SOLDER BALLS.
PIN A1
E2
D2
D
E
B
M
0.2
C
0.2
4X
TOP VIEW
(D1)
A
(E1)
4X
e
19X
e
/2
19X
e
1 2 3
5
4
6 7 8 9 10 11 12 13 14 15 16 17 18 19
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
20
V
W
Y
272X
b3
C
B
M
0.3
A
M
0.15
A
SIDE VIEW
0.35 A
A
0.2
A
272X
A
BOTTOM VIEW
A2
A1
A3
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