參數(shù)資料
型號: MPC7457EC
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: RISC Microprocessor Hardware Specifications
中文描述: RISC微處理器硬件規(guī)格
文件頁數(shù): 52/68頁
文件大?。?/td> 1755K
代理商: MPC7457EC
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 5
52
Freescale Semiconductor
System Design Information
9.5
Output Buffer DC Impedance
The MPC7457 processor bus and L3 I/O drivers are characterized over process, voltage, and temperature. To
measure Z
0
, an external resistor is connected from the chip pad to OV
DD
or GND. Then, the value of each resistor
is varied until the pad voltage is OV
DD
/2 (see
Figure 23
).
The output impedance is the average of two components, the resistances of the pull-up and pull-down devices. When
data is held low, SW2 is closed (SW1 is open), and R
N
is trimmed until the voltage at the pad equals OV
DD
/2. R
N
then becomes the resistance of the pull-down devices. When data is held high, SW1 is closed (SW2 is open), and
R
P
is trimmed until the voltage at the pad equals OV
DD
/2. R
P
then becomes the resistance of the pull-up devices. R
P
and R
N
are designed to be close to each other in value. Then, Z
0
= (R
P
+ R
N
)/2.
Figure 25. Driver Impedance Measurement
Table 21
summarizes the signal impedance results. The impedance increases with junction temperature and is
relatively unaffected by bus voltage.
9.6
Pull-Up/Pull-Down Resistor Requirements
The MPC7457 requires high-resistive (weak: 4.7-k
) pull-up resistors on several control pins of the bus interface to
maintain the control signals in the negated state after they have been actively negated and released by the MPC7457
or other bus masters. These pins are: TS, ARTRY, SHDO, and SHD1.
Some pins designated as being for factory test must be pulled up to OV
DD
or down to GND to ensure proper device
operation. For the MPC7447, 360 BGA, the pins that must be pulled up to OV
DD
are: LSSD_MODE and TEST[0:3];
the pins that must be pulled down to GND are: L1_TSTCLK and TEST[4]. For the MPC7457, 483 BGA, the pins
that must be pulled up to OV
DD
are: LSSD_MODE and TEST[0:5]; the pins that must be pulled down are:
Table 21. Impedance Characteristics
V
DD
= 1.5 V, OV
DD
= 1.8 V ± 5%, T
j
= 5°–85°C
Impedance
Processor Bus
L3 Bus
Unit
Z
0
Typical
33–42
34–42
Maximum
31–51
32–44
OV
DD
OGND
R
P
R
N
Pad
Data
SW1
SW2
相關(guān)PDF資料
PDF描述
MPC8241TZQ200C Intergrated Processor Hardware Specifications
MPC8241TZQ266C Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT06; Number of Contacts:30; Connector Shell Size:18; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight
MPC8241TZQ266D Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT06; No. of Contacts:30; Connector Shell Size:18; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight
MPC8241 Intergrated Processor Hardware Specifications
MPC8241TZP166C Intergrated Processor Hardware Specifications
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC745BPX300LE 功能描述:微處理器 - MPU 255 PBGAREV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC745BPX350LE 功能描述:微處理器 - MPU 255 PBGAREV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC745BVT300LE 功能描述:微處理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC745BVT350LE 功能描述:微處理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC745CPX350LE 功能描述:微處理器 - MPU GF REV 2.8 105C 6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324