- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄359188 > MPC7457EC (飛思卡爾半導(dǎo)體(中國(guó))有限公司) RISC Microprocessor Hardware Specifications PDF資料下載
參數(shù)資料
| 型號(hào)： | MPC7457EC |
| 廠商： | 飛思卡爾半導(dǎo)體(中國(guó))有限公司 |
| 英文描述： | RISC Microprocessor Hardware Specifications |
| 中文描述： | RISC微處理器硬件規(guī)格 |
| 文件頁(yè)數(shù)： | 59/68頁(yè) |
| 文件大?。?/td> | 1755K |
| 代理商： | MPC7457EC |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)當(dāng)前第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 5
Freescale Semiconductor
59
System Design Information
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc.
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
800-248-2481
888-642-7674
888-246-9050
The following section provides a heat sink selection example using one of the commercially available heat sinks.
9.8.3
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
T
j
= T
I
+ T
r
+ (R
θ
JC
+ R
θ
int
+ R
θ
sa
)
×
P
d
where:
T
j
is the die-junction temperature
T
I
is the inlet cabinet ambient temperature
T
r
is the air temperature rise within the computer cabinet
R
θ
JC
is the junction-to-case thermal resistance
R
θ
int
is the adhesive or interface material thermal resistance
R
θ
sa
is the heat sink base-to-ambient thermal resistance
P
d
is the power dissipated by the device
During operation, the die-junction temperatures (T
j
) should be maintained less than the value specified in
Table 4
.
The temperature of air cooling the component greatly depends on the ambient inlet air temperature and the air
temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (T
a
) may range from 30°
to 40°C. The air temperature rise within a cabinet (T
r
) may be in the range of 5° to 10°C. The thermal resistance of
the thermal interface material (R
θ
int
) is typically about 1.5°C/W. For example, assuming a T
a
of 30°C, a T
r
of 5°C,
a CBGA package R
θ
JC
= 0.1, and a typical power consumption (P
d
) of 18.7 W, the following expression for T
j
is
obtained:
Die-junction temperature: T
j
= 30°C + 5°C + (0.1°C/W + 1.5°C/W +
θ
sa
)
×
18.7 W
For this example, a R
θ
sa
value of 2.1°C/W or less is required to maintain the die junction temperature below the
maximum value of
Table 4
.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure-of-merit
used for comparing the thermal performance of various microelectronic packaging technologies, one should
exercise caution when only using this metric in determining thermal management because no single parameter can
adequately describe three-dimensional heat flow. The final die-junction operating temperature is not only a function
of the component-level thermal resistance, but the system-level design and its operating conditions. In addition to
the component's power consumption, a number of factors affect the final operating die-junction
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC8241TZQ200C | Intergrated Processor Hardware Specifications |
| MPC8241TZQ266C | Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT06; Number of Contacts:30; Connector Shell Size:18; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight |
| MPC8241TZQ266D | Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT06; No. of Contacts:30; Connector Shell Size:18; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight |
| MPC8241 | Intergrated Processor Hardware Specifications |
| MPC8241TZP166C | Intergrated Processor Hardware Specifications |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC745BPX300LE | 功能描述:微處理器 - MPU 255 PBGAREV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC745BPX350LE | 功能描述:微處理器 - MPU 255 PBGAREV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC745BVT300LE | 功能描述:微處理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC745BVT350LE | 功能描述:微處理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC745CPX350LE | 功能描述:微處理器 - MPU GF REV 2.8 105C 6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。