參數(shù)資料
型號(hào): SPC5634MF1MMG80
廠商: Freescale Semiconductor
文件頁數(shù): 20/122頁
文件大小: 0K
描述: IC MCU FLASH 1.5M 94K 208-PBGA
標(biāo)準(zhǔn)包裝: 90
系列: MPC56xx Qorivva
核心處理器: e200z3
芯體尺寸: 32-位
速度: 80MHz
連通性: CAN,EBI/EMI,LIN,SCI,SPI,UART/USART
外圍設(shè)備: DMA,POR,PWM,WDT
輸入/輸出數(shù): 114
程序存儲(chǔ)器容量: 1.5MB(1.5M x 8)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 94K x 8
電壓 - 電源 (Vcc/Vdd): 4.5 V ~ 5.25 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 34x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 150°C
封裝/外殼: 208-BGA
包裝: 托盤
MPC5634M Microcontroller Data Sheet, Rev. 9
Document revision history
Freescale Semiconductor
116
7
Document revision history
Table 43 summarizes revisions to this document.
Table 43. Revision history
Revision
Date
Description of Changes
Rev. 1
4/2008
Initial release
Rev. 2
12/2008
Maximum amount of flash increased from 1 MB to 1.5 MB. Flash memory type has
changed. Rev. 1 and later devices use LC flash instead of FL flash.
Additional packages offered—now includes100 LQFP and 176 LQFP. Please note that
the pinouts can vary for the same package depending on the amount of flash memory
included in the device.
Device comparison table added.
Feature details section added
Signal summary table expanded. Now includes PCR register numbers and signal
selection values and pin numbers for all production packages.
Electrical characteristics updated.
DSPI timing data added for 40 MHz and 60 MHz.
Thermal characteristics data updated. Data added for 100- and 176-pin packages.
DSPI LVDS pad specifications added.
Rev. 3
2/2009
Electrical characteristics updated
Flash memory electrical characteristics updated for LC flash
Power management control (PMC) and Power on Reset (POR) specifications updated
EMI characteristics data added
Maximum ratings updated
I/O pad current specifications updated
I/O Pad VRC33 current specifications added
Temperature sensor electrical characteristics added
Pad type added to “Voltage” column of signal summary table
Many signal names have changed to make them more understandable
DSPI: PCS_C[n] is now DSPI_C_PCS[n]; SOUT_C is now DSPI_C_SOUT, SIN_C is
now DSPI_C_SIN, and SCK_C is now DSPI_C_SCK
CAN: CNTXB is now CAN_B_TX and CNRXB is now CAN_B_RC
SCI: RXDB is now SCI_B_RX and TXDB is now SCI_B_TX
In cases where multiple instances of the same IP block is incorporated into the device,
e.g., 2 SCI blocks, the above nomenclature applies to all blocks
“No connect” pins on pinouts clarified
Pins labelled “NIC” have no internal connection and should be tied to ground
Pins labelled “NC” are not functional pins but may be connected to internal circuits
They are to be left floating
Some of the longer multiplexed signal names appearing on pinouts have been moved to
the inside of the package body to avoid having to use smaller fonts
Orderable parts table updated
Part number decoder added
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