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參數(shù)資料
| 型號： | AD14060LBF-4 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 40/48頁 |
| 文件大小： | 0K |
| 描述： | IC DSP CMOS 32BIT 308CQFP |
| 產(chǎn)品培訓(xùn)模塊： | SHARC Processor Overview |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | SHARC® |
| 類型： | 浮點(diǎn) |
| 接口： | 主機(jī)接口，連接端口，串行端口 |
| 時(shí)鐘速率： | 40MHz |
| 非易失內(nèi)存： | 外部 |
| 芯片上RAM： | 2MB |
| 電壓 - 輸入/輸出： | 3.30V |
| 電壓 - 核心： | 3.30V |
| 工作溫度： | -40°C ~ 100°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 308-CBQFP |
| 供應(yīng)商設(shè)備封裝： | 308-CQFP（52x52） |
| 包裝： | 托盤 |
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AD14060/AD14060L
Rev. B | Page 45 of 48
00667-037
LOAD CAPACITANCE (pF)
200
0
20
40
60
80
100
120
140
160
180
RIS
E
AND
FALL
TIME
S
(ns
)
(0
.8V
–
2.0V)
9
8
7
5
4
6
3
2
1
0
Y = 0.0391X + 0.36
Y = 0.0305X + 0.24
RISE TIME
FALL TIME
Figure 37. Typical Output Rise Time (0.8 V to 2.0 V)
vs. Load Capacitance (VDD = 3.3 V)
00667-038
LOAD CAPACITANCE (pF)
200
25
50
75
100
125
150
175
4.5
OUTP
UT
DE
LAY
OR
HOLD
(ns
)
5.0
4.0
–0.7
3.0
2.0
1.0
NOMINAL
–1.0
Y = 0.0329X – 1.65
Figure 38. Typical Output Delay or Hold vs. Load Capacitance
at Maximum Case Temperature (VDD = 3.3 V)
ASSEMBLY RECOMMENDATIONS
Socket Information
Standard sockets and carriers are available for the
AD14060/AD14060L, if needed. Socket part number
IC53-3084-262 and carrier part number ICC-308-1 are
available from Yamaichi Electronics.
Trim and Form
The AD14060/AD14060L is shipped as shown in Figure 43 with
untrimmed and unformed leads and with the nonconductive tie
bar in place. This avoids disturbance of lead spacing and
coplanarity prior to assembly. Optimally, the leads should be
trimmed, formed, and solder-dipped just prior to placement on
the board.
Trim/form can be accomplished with a universal trim/form,
a customer-designed trim/form, or with the Analog Devices
developed tooling described as follows.
A trim/form tool specific to the AD14060/AD14060L has been
developed and is available for use by all parties at
Tintronics Industries
2122-A Metro Circle
Huntsville, AL 35801
256-650-0220
Contact Person: Tom Rice
The package outline and dimensions resulting from this tool are
shown in Figure 39. (Alternatively, the package can be
trimmed/formed for cavity-down placement.)
0.170
(4.318)
2.110 (53.59)
2.210 ± 0.010 (56.134 ± 0.254)
0.016 MIN
0TO 10MILS
0
° TO 8°
DETAIL A
00667-039
Figure 39. Package and Lead Profile
Dimensions shown in inches and (millimeters)
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