參數(shù)資料
型號(hào)： ADSP-BF504BCPZ-4F
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 8/80頁(yè)
文件大?。?/td> 0K
描述： IC CCD SIGNAL PROCESSOR 88LFCSP
視頻文件： Blackfin? BF50x Processor Family
標(biāo)準(zhǔn)包裝： 1
系列： Blackfin®
類型： 定點(diǎn)
接口： CAN，EBI/EMI，I²C，IrDA，PPI，SPI，SPORT，UART/USART
時(shí)鐘速率： 400MHz
非易失內(nèi)存： 閃存（16MB）
芯片上RAM： 68kB
電壓 - 輸入/輸出： 3.30V
電壓 - 核心： 1.29V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 88-VFQFN 裸露焊盤，CSP
供應(yīng)商設(shè)備封裝： 88-LFCSP（12x12）
包裝： 托盤
Rev. A
|
Page 16 of 80
|
July 2011
ADSP-BF504/ADSP-BF504F/ADSP-BF506F
All on-chip peripherals are clocked by the system clock (SCLK).
The system clock frequency is programmable by means of the
SSEL3–0 bits of the PLL_DIV register. The values programmed
into the SSEL fields define a divide ratio between the PLL output
(VCO) and the system clock. SCLK divider values are 1 through
15. Table 6 illustrates typical system clock ratios.
Note that the divisor ratio must be chosen to limit the system
clock frequency to its maximum of fSCLK. The SSEL value can be
changed dynamically without any PLL lock latencies by writing
the appropriate values to the PLL divisor register (PLL_DIV).
The core clock (CCLK) frequency can also be dynamically
changed by means of the CSEL1–0 bits of the PLL_DIV register.
Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in
Table 7. This programmable core clock capability is useful for
fast core frequency modifications.
The maximum CCLK frequency both depends on the part’s
speed grade and depends on the applied VDDINT voltage. See
Table 14 for details. The maximal system clock rate (SCLK)
depends on the applied VDDINT and VDDEXT voltages (see
BOOTING MODES
The processor has several mechanisms (listed in Table 8) for
automatically loading internal and external memory after a
reset. The boot mode is defined by the BMODE input pins dedi-
cated to this purpose. There are two categories of boot modes.
In master boot modes, the processor actively loads data from
parallel or serial memories. In slave boot modes, the processor
receives data from external host devices.
The boot modes listed in Table 8 provide a number of mecha-
nisms for automatically loading the processor’s internal and
external memories after a reset. By default, all boot modes use
the slowest meaningful configuration settings. Default settings
can be altered via the initialization code feature at boot time.
Some boot modes require a boot host wait (HWAIT) signal,
which is a GPIO output signal that is driven and toggled by the
boot kernel at boot time. If pulled high through an external pull-
up resistor, the HWAIT signal behaves active high and will be
driven low when the processor is ready for data. Conversely,
when pulled low, HWAIT is driven high when the processor is
ready for data. When the boot sequence completes, the HWAIT
pin can be used for other purposes. The BMODE pins of the
reset configuration register, sampled during power-on resets
and software-initiated resets, implement the modes shown in
IDLE State / No Boot (BMODE = 0x0)—In this mode, the
boot kernel transitions the processor into Idle state. The
processor can then be controlled through JTAG for recov-
ery, debug, or other functions.
Boot from stacked parallel flash in 16-bit asynchronous
mode (BMODE = 0x1)—In this mode, conservative timing
parameters are used to communicate with the flash device.
The boot kernel communicates with the flash device
asynchronously.
Boot from stacked parallel flash in 16-bit synchronous
mode (BMODE = 0x2)—In this mode, fast timing parame-
ters are used to communicate with the flash device. The
boot kernel configures the flash device for synchronous
burst communication and boots from the flash
synchronously.
Figure 5. Frequency Modification Methods
Table 6. Example System Clock Ratios
Signal Name
SSEL3–0
Divider Ratio
VCO/SCLK
Example Frequency Ratios
(MHz)
VCO
SCLK
0001
1:1
50
0110
6:1
300
50
1010
10:1
400
40
Table 7. Core Clock Ratios
Signal Name
CSEL1–0
Divider Ratio
VCO/CCLK
Example Frequency Ratios
(MHz)
VCO
CCLK
00
1:1
300
01
2:1
300
150
10
4:1
400
100
11
8:1
200
25
PLL
0.5
u to 64u
÷1 to 15
÷1, 2, 4, 8
VCO
CLKIN
“FINE” ADJUSTMENT
REQUIRES PLL SEQUENCING
“COARSE” ADJUSTMENT
ON-THE-FLY
CCLK
SCLK
d CCLK
Table 8. Booting Modes
BMODE2–0 Description
000
Idle/No Boot
001
Boot from internal parallel flash in async mode1
1 This boot mode applies to ADSP-BF504F and ADSP-BF506F processors only.
010
Boot from internal parallel flash in sync mode1
011
Boot through SPI0 master from SPI memory
100
Boot through SPI0 slave from host device
101
Boot through PPI from host
110
Reserved
111
Boot through UART0 slave from host device
相關(guān)PDF資料
PDF描述
MAX6519UKP055+T IC TEMP SENSOR SW SOT23-5
ADSP-BF526KBCZ-3 IC DSP CTRLR 300MHZ 289CSPBGA
TRJC107K010RRJ CAP TANT 100UF 10V 10% 2312
ECM12DRKI CONN EDGECARD 24POS DIP .156 SLD
ECM08DRAI CONN EDGECARD 16POS R/A .156 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADSP-BF504KCPZ-3F 功能描述:IC CCD SIGNAL PROCESSOR 88LFCSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號(hào)處理器） 系列:Blackfin® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤
ADSP-BF504KCPZ-4 功能描述:IC CCD SIGNAL PROCESSOR 88LFCSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號(hào)處理器） 系列:Blackfin® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤
ADSP-BF504KCPZ-4F 功能描述:IC CCD SIGNAL PROCESSOR 88LFCSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號(hào)處理器） 系列:Blackfin® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤
ADSP-BF506BSWZ-3F 功能描述:IC DSP 400MHZ 1.4V 120LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號(hào)處理器） 系列:Blackfin® 標(biāo)準(zhǔn)包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點(diǎn) 接口:I²C，McASP，McBSP 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:548-FCBGA（27x27） 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA
ADSP-BF506BSWZ-4F 功能描述:IC DSP 400MHZ 1.4V 120LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號(hào)處理器） 系列:Blackfin® 標(biāo)準(zhǔn)包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點(diǎn) 接口:I²C，McASP，McBSP 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:548-FCBGA（27x27） 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*