參數(shù)資料
型號： DS3112+
廠商： Maxim Integrated Products
文件頁數(shù)： 7/133頁
文件大?。?/td> 0K
描述： IC MUX TEMPE T3/E3 256-BGA
產(chǎn)品培訓模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標準包裝： 40
控制器類型： 調(diào)幀器，多路復(fù)用器
接口： 并行/串行
電源電壓： 3.135 V ~ 3.465 V
電流 - 電源： 150mA
工作溫度： 0°C ~ 70°C
安裝類型： 表面貼裝
封裝/外殼： 256-LBGA
供應(yīng)商設(shè)備封裝： 256-PBGA（27x27）
包裝： 管件
產(chǎn)品目錄頁面： 1419 (CN2011-ZH PDF)
DS3112
104 of 133
11.3.3
11.2.6 CLAMP
All digital outputs will output data from the boundary scan parallel output while connecting the Bypass
Register between JTDI and JTDO. The outputs will not change during the CLAMP instruction.
11.3 Test Registers
IEEE 1149.1 requires a minimum of two test registers, the bypass register and the boundary scan register.
An optional test register, the Identification register, has been included in the DS3112 design. It is used in
conjunction with the IDCODE instruction and the Test-Logic-Reset state of the TAP controller.
11.3.1 Bypass Register
This is a single one-bit shift register used in conjunction with the BYPASS, CLAMP, and HIGH-Z
instructions that provides a short path between JTDI and JTDO.
11.3.2 Identification Register
The Identification register contains a 32-bit shift register and a 32-bit latched parallel output. This register
is selected during the IDCODE instruction and when the TAP controller is in the Test-Logic-Reset state.
Boundary Scan Register
This register contains both a shift register path and a latched parallel output for all control cells and
digital I/O cells and is 196 bits in length.
shows all the cell bit locations and definitions.
Table 11-2. Boundary Scan Control Bits
BIT
SYMBOL
PIN
I/O OR CONTROL BIT
DESCRIPTION
0
OUT_ENB
Control bit
0 = outputs are active
1 = outputs are tri-state (“z”)
1
TEST
C3
I
2
CINT_ENB_N
Control bit
0 =
CINT is a zero (“0”)
1 =
CINT is tri-state (“z”)
3
CINT_OUT
A2
O (open drain)
4
CINT_IN
A2
I
5
CMS
B2
I
6
CIM
B3
I
7
CCS
C4
I
8
CRD
D5
I
9
CWR
A3
I
10
T3E3MS
B4
I
11
RST
C5
I
12
G.747E
B6
I
13
CALE
C7
I
14
FRMECU
A7
I
15
FRLOF
C8
O
16
FRLOS
B8
O
17
FRSOF
A8
O
18
FRDEN
C9
O
19
FRD
B9
O
20
FRCLK
A9
O
21
FTDEN
C10
O
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參數(shù)描述
DS3112+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112+W 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112D1 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112D1+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112DK 功能描述:網(wǎng)絡(luò)開發(fā)工具 DS3112 Dev Kit RoHS:否 制造商:Rabbit Semiconductor 產(chǎn)品:Development Kits 類型:Ethernet to Wi-Fi Bridges 工具用于評估:RCM6600W 數(shù)據(jù)速率:20 Mbps, 40 Mbps 接口類型:802.11 b/g, Ethernet 工作電源電壓:3.3 V
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