- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄11582 > DS3112+ (Maxim Integrated Products)IC MUX TEMPE T3/E3 256-BGA PDF資料下載
參數(shù)資料
| 型號(hào)： | DS3112+ |
| 廠商： | Maxim Integrated Products |
| 文件頁(yè)數(shù)： | 88/133頁(yè) |
| 文件大小： | 0K |
| 描述： | IC MUX TEMPE T3/E3 256-BGA |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 40 |
| 控制器類(lèi)型： | 調(diào)幀器，多路復(fù)用器 |
| 接口： | 并行/串行 |
| 電源電壓： | 3.135 V ~ 3.465 V |
| 電流 - 電源： | 150mA |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 256-LBGA |
| 供應(yīng)商設(shè)備封裝： | 256-PBGA（27x27） |
| 包裝： | 管件 |
| 產(chǎn)品目錄頁(yè)面： | 1419 (CN2011-ZH PDF) |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)當(dāng)前第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)
DS3112
58 of 133
Bit 5: Severely Errored Framing Event Detected (SEFE). This latched read-only event-status bit will be set to a
one each time the DS3112 has detected either three or more F bits in error out of 16 consecutive F bits (T3 mode)
or four bad FAS words in a row (E3 mode). This bit will be cleared when read and will not be set again until the
device detects another SEFE event.
Bit 8: E3 National Bit (E3Sn). This read-only real-time status bit reports the incoming E3 National Bit (Sn). It is
loaded at the start of each E3 frame as the Sn bit is decoded. The host can use the RSOF status bit in the T3/E3
Status Register (T3E3SR) to determine when to read this bit.
Bit 9: T3 Application ID Channel Status (T3AIC). This read-only real-time status bit can be used to help
determine whether an incoming T3 data stream is in C-Bit Parity mode or M23 mode. In C-Bit Parity mode, it is
recommended that the first C bit in each M frame be set to one. In M23 mode, the first C bit in each M frame
should be toggling between zero and one to indicate that the bits need to be stuffed or not. This bit will be set to a
one when the device detects that the first C bit in the M frame is set to one for 1020 times or more out of 1024
consecutive M frames (109ms). It will be allowed to be cleared when the device detects that the first C bit is set to
one less than 1020 times out of 1024 consecutive M frames (109ms). This status bit has no meaning in the E3 mode
and should be ignored.
Bit 10: Loss Of Signal Clear Detected (LOSC). This latched read-only event-status bit will be set to a one each
time the T3/E3 framer exits a Loss Of Signal (LOS) state. This bit will be cleared when read and will not be set
again until the device once again exits the LOS state. The LOS alarm criteria are described in Table 5-1 and
Table 5-2. This status bit is useful in helping the host determine if the LOS persists as defined in ANSI T1.231.
Bit 11: Loss Of Frame Clear Detected (LOFC). This latched read-only event-status bit will be set to a one each
time the T3/E3 framer exits a Loss Of Frame (LOF) state. This bit will be cleared when read and will not be set
again until the device once again exits the LOF state. The LOF alarm criteria are described in Table 5-1 and
Table 5-2. This status bit is useful in helping the host determine if the LOF persists as defined in ANSI T1.231.
Bit 12: Alarm Indication Signal Clear Detected (AISC). This latched read-only event status bit will be set to a
one each time the T3/E3 framer no longer detects the AIS alarm state. This bit will be cleared when read and will
not be set again until the device once again exits the AIS alarm state. The AIS alarm criteria is described in
Table 5-1 and Table 5-2. This status bit is useful in helping the host determine if the AIS persists as defined in
Bit 13: Remote Alarm Indication Clear Detected (RAIC). This latched read-only event-status bit will be set to a
one each time the T3/E3 framer no longer detects the RAI alarm state. This bit will be cleared when read and will
not be set again until the device once again exits the RAI alarm state. The RAI alarm criteria are described in
Table 5-1 and Table 5-2. This status bit is useful in helping the host determine if the RAI persists as defined in
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PIC16F1847-E/P | MCU 14KB FLASH 1KB RAM 18PDIP |
| DS21Q43AT+ | IC FRAMER E1 QUAD 5V IND 128TQFP |
| PIC16LF1847-E/P | MCU 14KB FLASH 1KB RAM 18PDIP |
| DS21Q43AT | IC FRAMER E1 QUAD 5V IND 128TQFP |
| DS2143Q | IC CONTROLLER E1 5V LP 44-PLCC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DS3112+ | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS3112+W | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS3112D1 | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS3112D1+ | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS3112DK | 功能描述:網(wǎng)絡(luò)開(kāi)發(fā)工具 DS3112 Dev Kit RoHS:否 制造商:Rabbit Semiconductor 產(chǎn)品:Development Kits 類(lèi)型:Ethernet to Wi-Fi Bridges 工具用于評(píng)估:RCM6600W 數(shù)據(jù)速率:20 Mbps, 40 Mbps 接口類(lèi)型:802.11 b/g, Ethernet 工作電源電壓:3.3 V |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。