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參數(shù)資料
| 型號： | ISP1583ET2 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 總線控制器 |
| 英文描述： | UNIVERSAL SERIAL BUS CONTROLLER, PBGA64 |
| 封裝： | 6 X 6 MM, 0.80 MM HEIGHT, LEAD FREE, PLASTIC, MO-195, SOT543-1,TFBGA-64 |
| 文件頁數(shù)： | 91/100頁 |
| 文件大?。?/td> | 508K |
| 代理商： | ISP1583ET2 |
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ISP1583_7
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 07 — 22 September 2008
89 of 99
NXP Semiconductors
ISP1583
Hi-Speed USB peripheral controller
17. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reow
soldering description”.
17.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for ne pitch SMDs. Reow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
17.2 Wave and reow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature prole. Leaded packages,
packages with solder balls, and leadless packages are all reow solderable.
Key characteristics in both wave and reow soldering are:
Board specications, including the board nish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
17.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1583ET2,518 | 功能描述:外圍驅(qū)動器與原件 - PCI USB 2.0 DEVICE RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| ISP1583ET2-T | 功能描述:外圍驅(qū)動器與原件 - PCI USB 2.0 DEVICE RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| ISP1583ET-T | 功能描述:外圍驅(qū)動器與原件 - PCI HI-SPEED USB2 DEVICE RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| ISP1583ETUM | 功能描述:IC USB CTRL HI-SPEED 64TFBGA RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應商設備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A |
| ISP166 | 功能描述:機架和機柜配件 PANELS 1600HX600D RoHS:否 制造商:Bivar 產(chǎn)品:Rack Accessories 面板空間: 顏色:Black |
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