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參數(shù)資料
| 型號(hào)： | ISP1583ET2 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 總線控制器 |
| 英文描述： | UNIVERSAL SERIAL BUS CONTROLLER, PBGA64 |
| 封裝： | 6 X 6 MM, 0.80 MM HEIGHT, LEAD FREE, PLASTIC, MO-195, SOT543-1,TFBGA-64 |
| 文件頁(yè)數(shù)： | 92/100頁(yè) |
| 文件大?。?/td> | 508K |
| 代理商： | ISP1583ET2 |
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ISP1583_7
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 07 — 22 September 2008
90 of 99
NXP Semiconductors
ISP1583
Hi-Speed USB peripheral controller
17.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 42) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 111 and 112
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 42.
Table 111. SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 112. Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù) |
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| ISP1583ET2,518 | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI USB 2.0 DEVICE RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| ISP1583ET2-T | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI USB 2.0 DEVICE RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| ISP1583ET-T | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI HI-SPEED USB2 DEVICE RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| ISP1583ETUM | 功能描述:IC USB CTRL HI-SPEED 64TFBGA RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A |
| ISP166 | 功能描述:機(jī)架和機(jī)柜配件 PANELS 1600HX600D RoHS:否 制造商:Bivar 產(chǎn)品:Rack Accessories 面板空間: 顏色:Black |
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