April 2006
Data Sheet DS1003
2006 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specications and information herein are subject to change without notice.
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1-1
DS1003 Introduction_01.0
Features
■ Non-volatile, Innitely Recongurable
Instant-on – powers up in microseconds
Single chip, no external conguration memory
required
Excellent design security, no bit stream to
intercept
Recongure SRAM based logic in milliseconds
SRAM and non-volatile memory programmable
through JTAG port
Supports background programming of
non-volatile memory
■ AEC-Q100 Tested and Qualied
■ Sleep Mode
Allows up to 100x static current reduction
■ TransFR Reconguration (TFR)
In-eld logic update while system operates
■ High I/O to Logic Density
256 to 2280 LUT4s
73 to 271 I/Os with extensive package options
Density migration supported
Lead free/RoHS compliant packaging
■ Embedded and Distributed Memory
Up to 27.6 Kbits sysMEM Embedded Block
RAM
Up to 7.5 Kbits distributed RAM
Dedicated FIFO control logic
■ Flexible I/O Buffer
Programmable sysIO buffer supports wide
range of interfaces:
LVCMOS 3.3/2.5/1.8/1.5/1.2
LVTTL
PCI
LVDS, Bus-LVDS, LVPECL, RSDS
■ sysCLOCK PLLs
Up to two analog PLLs per device
Clock multiply, divide, and phase shifting
■ System Level Support
IEEE Standard 1149.1 Boundary Scan
Onboard oscillator
Devices operate with 3.3V, 2.5V, 1.8V or 1.2V
power supply
IEEE 1532 compliant in-system programming
Introduction
The LA-MachXO automotive device family is optimized
to meet the requirements of applications traditionally
addressed by CPLDs and low capacity FPGAs: glue
logic, bus bridging, bus interfacing, power-up control,
and control logic. These devices bring together the best
features of CPLD and FPGA devices on a single chip in
AEC-Q100 tested and qualied versions.
The devices use look-up tables (LUTs) and embedded
block memories traditionally associated with FPGAs for
exible and efcient logic implementation. Through non-
volatile technology, the devices provide the single-chip,
Table 1-1. LA-MachXO Automotive Family Selection Guide
Device
LAMXO256E/C
LAMXO640E/C
LAMXO1200E
LAMXO2280E
LUTs
256
640
1200
2280
Dist. RAM (Kbits)
2.0
6.0
6.25
7.5
EBR SRAM (Kbits)
0
9.2
27.6
Number of EBR SRAM Blocks (9 Kbits)
0013
VCC Voltage
1.2/1.8/2.5/3.3V
1.2
Number of PLLs
0012
Max. I/O
78
159
211
271
Packages
100-pin Lead-Free TQFP (14x14 mm)
78
74
73
144-pin Lead-Free TQFP (20x20 mm)
113
256-ball Lead-Free ftBGA (17x17 mm)
159
211
324-ball Lead-Free ftBGA (19x19 mm)
271
LA-MachXO Automotive Family Data Sheet
Introduction