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參數(shù)資料
| 型號： | MCIMX258CVM4 |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 400 MHz, MICROPROCESSOR, PBGA400 |
| 封裝： | 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400 |
| 文件頁數(shù)： | 66/154頁 |
| 文件大?。?/td> | 1498K |
| 代理商： | MCIMX258CVM4 |
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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 8
Freescale Semiconductor
19
The method for obtaining the maximum current is as follows:
1. Measure the worst case power consumption on individual rails using directed test on i.MX25.
2. Correlate the worst case power consumption power measurements with the worst case power
consumption simulations.
3. Combine common voltage rails based on the power supply sequencing requirements (add the
worst case power consumption on each rail within some test cases from several test cases run, to
maximize different rails in the power group).
4. Guard the worst case numbers for temperature and process variation.
5. The sum of individual rails is greater than the real world power consumption, since a real
system does not typically maximize the power consumption on all peripherals
simultaneously.
6. BATT_VDD current is measured when the system is in reduced power mode maintaining the
RTC. When the system is in run mode, QVDD is used to supply the DryIce, so this current
becomes negligible. Refer to Table 12, for more details on the power modes.
NOTE
The values mentioned above should not be taken as a typical max run data
for specific use cases. These values are Absolute MAX data. Freescale
recommends that the system current measurements are taken with
customer-specific use-cases to reflect normal operating conditions in the
end system
3.4
Thermal Characteristics
The thermal resistance characteristics for the device are given in Table 16. These values are measured
under the following conditions:
Two-layer substrate
Substrate solder mask thickness: 0.025 mm
Substrate metal thicknesses: 0.016 mm
Substrate core thickness: 0.200 mm
Core through I.D: 0.118 mm, Core through plating 0.016 mm.
Flag: Trace style with ground balls under the die connected to the flag
USBPHY1_VDDA_BIAS, USBPHY1_UPLL_VDD,
USBPHY1_VDDA, USBPHY2_VDD,
OSC24M_VDD, NVCC_ADC
3.3
40
FUSE_VDD1
3.6
62
BATT_VDD
1.55
0.030
1 The FUSE_VDD rail is connected to ground. it only needs a voltage if the system fuse burning is needed.
Table 15. Power Consumption (continued)
Power Supply
Voltage (V)
Max Current (mA)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MCIMX25LPDK | 制造商:Freescale Semiconductor 功能描述:PRODUCT DEVELOPMENT KIT FOR THE I MX25 APPLICATIONS PROCESSO - Boxed Product (Development Kits) 制造商:Freescale Semiconductor 功能描述:KIT DEV I.MX25 FOR LINUX 制造商:Freescale 功能描述:Product Development Kit For The I.MX25 Applications Processor |
| MCIMX25LPDKJ | 功能描述:開發(fā)板和工具包 - ARM HARDWARE RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V |
| MCIMX25LPDKJ | 制造商:Freescale Semiconductor 功能描述:; LEADED PROCESS COMPATIBLE:YES; PEAK RE |
| MCIMX25PDKCPUJ | 功能描述:開發(fā)板和工具包 - ARM CPU BD, MX25, LINUXJ RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V |
| MCIMX25WPDK | 功能描述:開發(fā)板和工具包 - ARM MCIMX25 PDK ForLINUX RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V |
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