參數(shù)資料
型號: MCIMX31
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: Multimedia Applications Processors
中文描述: 多媒體應(yīng)用處理器
文件頁數(shù): 100/170頁
文件大?。?/td> 1562K
代理商: MCIMX31
i.MX31/i.MX31L Advance Information, Rev. 1.4
100
Freescale Semiconductor
Preliminary
Electrical Characteristics
Figure 41. Mobile DDR SDRAM DQ versus DQS and SDCLK Read Cycle Timing Diagram
NOTE
SDRAM CLK and DQS related parameters are being measured from the
50% point—that is, high is defined as 50% of signal value and low is defined
as 50% of signal value.
4.3.10
ETM Electrical Specifications
ETM is an ARM protocol. There are no inherent restrictions on operating frequency, other than ASIC pad
technology and TPA limitations. ASIC designers must provide a TRACECLK as symmetrical as possible,
and with set-up and hold times as large as possible. TPA designers must conversely be able to support a
TRACECLK as asymmetrical as possible, and require set up and hold times as short as possible. The
timing specifications in this section are given as a guide for a TPA that supports TRACECLK frequencies
up to around 100 MHz.
NOTE
Actual processor clock frequencies vary according to application
requirements and the silicon process technologies used. The maximum
operating clock frequencies attained by ARM devices increases over time as
a result.
If a designer adheres to the timing described here, he or she can use any ARM-approved TPA.
Figure 42
depicts the TRACECLK timings of ETM, and
Table 40
lists the timing parameters.
Table 39. Mobile DDR SDRAM Read Cycle Timing Parameters
ID
Parameter
Symbol
Min
Max
Unit
SD21
DQS - DQ Skew (defines the Data valid window in
read cycles related to DQS).
tDQSQ
.85
ns
SD22
DQS DQ HOLD time from DQS
tQH
2.3
ns
SD23
DQS output access time from SDCLK posedge
tDQSCK
6.7
ns
SDCLK
SDCLK
DQS (input)
DQ (input)
Data
Data
Data
Data
Data
Data
Data
Data
SD23
SD21
SD22
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