- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄45342 > MPC5606SVLU6R (FREESCALE SEMICONDUCTOR INC) 32-BIT, FLASH, 64 MHz, MICROCONTROLLER, PQFP176 PDF資料下載
參數(shù)資料
| 型號(hào)： | MPC5606SVLU6R |
| 廠(chǎng)商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, FLASH, 64 MHz, MICROCONTROLLER, PQFP176 |
| 封裝： | 24 X 24 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MS-026BGA, LQFP-176 |
| 文件頁(yè)數(shù)： | 96/136頁(yè) |
| 文件大小： | 858K |
| 代理商： | MPC5606SVLU6R |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)當(dāng)前第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)
MPC5606S Microcontroller Data Sheet, Rev. 7
Freescale Semiconductor
62
RJA = junction to ambient thermal resistance (°C/W)
PD
= power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide consistent values for
estimations and comparisons. The difference between the values determined for the single-layer (1s) board compared to a
four-layer board that has two signal layers, a power and a ground plane (2s2p), demonstrate that the effective thermal resistance
is not a constant. The thermal resistance depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to connect the package
to the planes reduces the thermal performance. Thinner planes also reduce the thermal performance. When the clearance
between the vias leave the planes virtually disconnected, the thermal performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly packed printed circuit
board. The value obtained on a board with the internal planes is usually within the normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm
2
The thermal performance of any component depends on the power dissipation of the surrounding components. In addition, the
ambient temperature varies widely within the application. For many natural convection and especially closed box applications,
the board temperature at the perimeter (edge) of the package is approximately the same as the local air temperature near the
device. Specifying the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using Equation 2:
TJ = TB + (RJB PD)
Eqn. 2
where:
TB
= board temperature for the package perimeter (°C)
RJB = junction-to-board thermal resistance (°C/W) per JESD51-8S
PD
= power dissipation in the package (W)
When the heat loss from the package case to the air does not factor into the calculation, an acceptable value for the junction
temperature is predictable. Ensure the application board is similar to the thermal test condition, with the component soldered to
a board with internal planes.
The thermal resistance is expressed as the sum of a junction-to-case thermal resistance plus a case-to-ambient thermal
resistance:
RJA = RJC + RCA
Eqn. 3
where:
RJA = junction to ambient thermal resistance (°C/W)
RJC = junction to case thermal resistance (°C/W)
RCA = case to ambient thermal resistance (°C/W)
RJC s device related and is not affected by other factors. The thermal environment can be controlled to change the
case-to-ambient thermal resistance, RCA. For example, change the air flow around the device, add a heat sink, change the
mounting arrangement on the printed circuit board, or change the thermal dissipation on the printed circuit board surrounding
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC5606SVLU6 | 32-BIT, FLASH, 64 MHz, MICROCONTROLLER, PQFP176 |
| MPC5606SCLQ6R | 32-BIT, FLASH, 64 MHz, MICROCONTROLLER, PQFP144 |
| MPC5607BCLQ6R | FLASH, 64 MHz, MICROCONTROLLER, PQFP144 |
| MPC5607BVLL4R | FLASH, 48 MHz, MICROCONTROLLER, PQFP100 |
| MPC5607BCMG4 | FLASH, 48 MHz, MICROCONTROLLER, PBGA208 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC5607B | 制造商:Freescale Semiconductor 功能描述: |
| MPC5607B_13 | 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:MicrocontrollerData Sheet |
| MPC5607BECLLR | 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5607BECLQR | 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5607BECLUR | 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Microcontroller |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。