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參數資料
| 型號： | MPC755BRX300LE |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | RISC Microprocessor Hardware Specifications |
| 中文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360 |
| 封裝： | 25 X 25 MM, CERAMIC, BGA-360 |
| 文件頁數： | 31/56頁 |
| 文件大?。?/td> | 1652K |
| 代理商： | MPC755BRX300LE |
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MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
31
Package Description
7
Package Description
The following sections provide the package parameters and mechanical dimensions for the MPC745, 255 PBGA
package, as well as the MPC755, 360 CBGA and PBGA packages. While both the MPC755 plastic and ceramic
packages are described here, both packages are not guaranteed to be available at the same time. All new designs
should allow for either ceramic or plastic BGA packages for this device. For more information on designing a
common footprint for both plastic and ceramic package types, see the
Freescale Flip-Chip Plastic Ball Grid Array
Presentation
. The MPC755 was initially sampled in a CBGA package, but production units are currently provided
in both a CBGA and a PBGA package. Because of the better long-term device-to-board interconnect reliability of
the PBGA package, Freescale recommends use of a PBGA package except where circumstances dictate use of a
CBGA package.
7.1
Package Parameters for the MPC745 PBGA
The package parameters are as provided in the following list. The package type is 21
×
21 mm, 255-lead plastic ball
grid array (PBGA).
Package outline
21
×
21 mm
Interconnects
255 (16
×
16 ball array – 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.25 mm
Maximum module height
2.80 mm
Ball diameter (typical)
0.75 mm (29.5 mil)
VOLTDET
K13
High
Output
L2OV
DD
8
Notes:
1. OV
DD
supplies power to the processor bus, JTAG, and all control signals except the L2 cache controls (L2CE, L2WE, and L2ZZ); L2OV
DD
supplies power to the L2 cache interface (L2ADDR[0:16], L2DATA[0:63], L2DP[0:7], and L2SYNC_OUT) and the L2 control signals; and V
DD
supplies power to the processor core and the PLL and DLL (after filtering to become AV
DD
and L2AV
DD
, respectively). These columns serve
as a reference for the nominal voltage supported on a given signal as selected by the BVSEL/L2VSEL pin configurations of
Table 2
and the
voltage supplied. For actual recommended value of V
in
or supply voltages, see
Table 3
.
2. These are test signals for factory use only and must be pulled up to OV
DD
for normal machine operation.
3. This pin must be pulled up to OV
DD
for proper operation of the processor interface. To allow for future I/O voltage changes, provide the option
to connect BVSEL independently to either OV
DD
or GND.
4. These pins are reserved for potential future use as additional L2 address pins.
5. Uses one of nine existing no connects in the MPC750, 360 BGA package.
6. Internal pull-up on die.
7. This pin must be pulled up to L2OV
DD
for proper operation of the processor interface. To allow for future I/O voltage changes, provide the
option to connect L2VSEL independently to either L2OV
DD
or GND.
8. Internally tied to L2OV
DD
in the MPC755, 360 BGA package to indicate the power present at the L2 cache interface. This signal is not a power
supply input.
Caution:
This differs from the MPC745, 255 BGA package.
Table 15. Pinout Listing for the MPC755, 360 BGA Package (continued)
Signal Name
Pin Number
Active
I/O
I/F Voltage
1
Notes
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| MPC8260ACZU | MPC826xA (HiP4) Family Hardware Specifications |
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相關代理商/技術參數 |
參數描述 |
|---|---|
| MPC755BRX350LE | 功能描述:微處理器 - MPU 360CBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755BRX350TE | 功能描述:微處理器 - MPU 360CBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755BVT300LE | 功能描述:微處理器 - MPU RV2.8106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755BVT350LE | 功能描述:微處理器 - MPU RV2.8,106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755CPX350LE | 功能描述:微處理器 - MPU 360PBGA,RV2.8,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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