參數(shù)資料
型號(hào): MPC755BRX300LE
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: RISC Microprocessor Hardware Specifications
中文描述: 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, CERAMIC, BGA-360
文件頁(yè)數(shù): 40/56頁(yè)
文件大?。?/td> 1652K
代理商: MPC755BRX300LE
MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
40
Freescale Semiconductor
System Design Information
R
N
then becomes the resistance of the pull-down devices. When data is held high, SW1 is closed (SW2 is open), and
R
P
is trimmed until the voltage at the pad equals (L2)OV
DD
/2. R
P
then becomes the resistance of the pull-up devices.
Figure 22
describes the driver impedance measurement circuit described above.
Figure 22. Driver Impedance Measurement Circuit
Alternately, the following is another method to determine the output impedance of the MPC755. A voltage source,
V
force
, is connected to the output of the MPC755 as shown in
Figure 23
. Data is held low, the voltage source is set
to a value that is equal to (L2)OV
DD
/2 and the current sourced by V
force
is measured. The voltage drop across the
pull-down device, which is equal to (L2)OV
DD
/2, is divided by the measured current to determine the output
impedance of the pull-down device, R
N
. Similarly, the impedance of the pull-up device is determined by dividing
the voltage drop of the pull-up, (L2)OV
DD
/2, by the current sank by the pull-up when the data is high and V
force
is
equal to (L2)OV
DD
/2. This method can be employed with either empirical data from a test setup or with data from
simulation models, such as IBIS.
R
P
and R
N
are designed to be close to each other in value. Then Z
0
= (R
P
+ R
N
)/2.
(L2)OV
DD
OGND
R
P
R
N
Pad
Data
SW1
SW2
(L2)OV
DD
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