參數(shù)資料
型號: MPC755BRX300LE
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: RISC Microprocessor Hardware Specifications
中文描述: 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, CERAMIC, BGA-360
文件頁數(shù): 49/56頁
文件大小: 1652K
代理商: MPC755BRX300LE
MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
49
System Design Information
Figure 28. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure-of-merit
used for comparing the thermal performance of various microelectronic packaging technologies, one should
exercise caution when only using this metric in determining thermal management because no single parameter can
adequately describe three-dimensional heat flow. The final die-junction operating temperature, is not only a function
of the component-level thermal resistance, but the system-level design and its operating conditions. In addition to
the component's power consumption, a number of factors affect the final operating die-junction
temperature—airflow, board population (local heat flux of adjacent components), heat sink efficiency, heat sink
attach, heat sink placement, next-level interconnect technology, system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's microelectronic
equipment, the combined effects of the heat transfer mechanisms (radiation, convection, and conduction) may vary
widely. For these reasons, we recommend using conjugate heat transfer models for the board, as well as,
system-level designs.
1
3
5
7
8
0
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin-Fin Heat Sink
(25
×
28
×
15 mm)
Approach Air Velocity (m/s)
2
4
6
H
°
C
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