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參數(shù)資料
| 型號： | MPC755BRX300LE |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | RISC Microprocessor Hardware Specifications |
| 中文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360 |
| 封裝： | 25 X 25 MM, CERAMIC, BGA-360 |
| 文件頁數(shù)： | 51/56頁 |
| 文件大?。?/td> | 1652K |
| 代理商： | MPC755BRX300LE |
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MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
51
Document Revision History
3
Updated format and thermal resistance specifications of Table 4.
Reformatted Tables 9, 10, 11, and 12.
Added dimensions A3, D1, and E1 to Figures 18, 19, and 20.
Revised Section 1.8.7 and Figure 25, removed Figure 26 and Table 19 (information now included in Figure 25).
Reformatted Section 1.10.
Clarified address bus and address attribute pull-up recommendations in Section 1.8.7.
Clarified Table 2.
Updated voltage sequencing requirements in Table 1 and removed Section 1.8.3.
4
Added 450 MHz speed bin.
Changed Table 16 to show 450 MHz part in example.
Added row for 433 and 450 MHz core frequencies to Table 17.
In Section 1.8.8, revised the heat sink vendor list.
In Section 1.8.8.2, revised the interface vendor list.
5
Added Note 6 to Table 10; clarification only as this information is already documented in the
MPC750 RISC Microprocessor
Family User’s Manual
.
Revised Figure 24 and Section 1.8.7.
Corrected Process Identifier for 450 MHz part in Table 20.
Added XPC755BRX
nnn
T
x
series to Table 21.
6
Removed 450 MHz speed grade throughout document. These devices are no longer supported for new designs; see
Section 1.10.2 for more information.
Relaxed voltage sequencing requirements in Notes 3 and 4 of Table 1.
Corrected Note 2 of Table 7.
Changed processor descriptor from ‘B’ to ‘C’ for 400 MHz devices and increased power specifications for full-power mode in
Table 7. XPC755Bxx400LE devices are no longer produced and are documented in a separate part number specification; see
Section 1.10.2 for more information.
Increased power specifications for sleep mode for all speed grades in Table 7.
Removed ‘Sleep Mode (PLL and DLL Disabled)—Typical’ specification from Table 7; this is no longer tested or characterized.
Added Note 4 to Table 7.
Revised L2 clock duty cycle specification in Table 11 and changed Note 7.
Corrected Note 3 in Table 20.
Replaced Table 21 and added Tables 22 and 23.
6.1
Document template update.
Table 19. Document Revision History (continued)
Rev. No.
Substantive Change(s)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC755BRX350LE | 功能描述:微處理器 - MPU 360CBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755BRX350TE | 功能描述:微處理器 - MPU 360CBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755BVT300LE | 功能描述:微處理器 - MPU RV2.8106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755BVT350LE | 功能描述:微處理器 - MPU RV2.8,106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755CPX350LE | 功能描述:微處理器 - MPU 360PBGA,RV2.8,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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