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參數(shù)資料
| 型號： | PC755BMZFU400LD |
| 英文描述： | MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC |
| 中文描述： | 微處理器| 32位|的CMOS | BGA封裝| 360PIN |塑料 |
| 文件頁數(shù)： | 19/48頁 |
| 文件大?。?/td> | 276K |
| 代理商： | PC755BMZFU400LD |
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PC755B/745B
19/48
Since the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the silicon may be neglected.
Thus, the heat sink attach material and the heat sink conduction/convective thermal resistances are the dominant terms.
External Resistance
Radiation
External Resistance
Internal Resistance
(Note the internal versus external package resistance)
Convection
Radiation
Convection
Heat Sink
Printed–Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
Figure 6 : C4 Package with Heat Sink Mounted to a Printed-Circuit Board
3.4.2. Thermal management assistance
The PC755B incorporates a thermal management assist unit (TAU) composed of a thermal sensor, digital-to-analog converter,
comparator, control logic, and dedicated special-purpose registers (SPRs). Specifications for the thermal sensor portion of the TAU
are found in Table 7. More information on the use of this feature is given in the Motorola PC755B RISC Microprocessor User’s manual.
Table 7. Thermal Sensor Specifications
At recommended operating conditions (See Table 5)
Characteristic
Min
Max
Unit
Notes
Temperature range
0
127
o
C
1
Comparator settling time
20
—
s
2,3
Resolution
4
—
o
C
3
Accuracy
-12
+12
o
C
3
Notes:
1. The temperature is the junction temperature of the die. The thermal assist unit’s raw output does not indicate an
absolute temperature, but must be interpreted by software to derive the absolute junction temperature. For infor-
mation about the use and calibration of the TAU, see Motorola Application Note AN1800/D, “Programming the
Thermal Assist Unit in the PC750 Microprocessor”.
2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into
the THRM3 SPR.
3. Guaranteed by design and characterization.
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