參數(shù)資料
型號: PC755BMZFU400LD
英文描述: MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
中文描述: 微處理器| 32位|的CMOS | BGA封裝| 360PIN |塑料
文件頁數(shù): 39/48頁
文件大小: 276K
代理商: PC755BMZFU400LD
PC755B/745B
39/48
7.1.2. Mechanical Dimensions of the PC745B PBGA package
Figure 25 provides the mechanical dimensions and
bottom surface nomenclature of the PC745B, 255 PBGA package.
M
NOTES:
A. DIMENSIONING AND TOLERANCING
PER ASME Y14.5M, 1994.
B. DIMENSIONS IN MILLIMETERS.
C. TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING
FROM THE ARRAY.
D. CAPACITOR PADS MAY BE
UNPOPULATED.
0.2
D
2X
A1 CORNER
E
0.2
B
A
A
A1
A2
C
0.2 C
B
C
C
255X
e
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
A
0.3
0.15
b
Millimeters
Min
2.25
0.50
1.00
0.60
21.00 BSC
21.00 BSC
1.27 BSC
DIM
A
A1
A2
b
D
E
e
Max
2.80
0.70
1.20
0.90
Figure 25 : Mechanical Dimensions and Bottom Surface Nomenclature of the PC745B PBGA
相關PDF資料
PDF描述
PC755BVZFU300LD MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
PC755 PowerPC 755/745 RISC Microprocessor
PC755M8 PC755M8 [Updated 6/03. 35 Pages] 32-bit RISC PowerPC-based Multichip Module
PC755CMGHU300LE PowerPC 755/745 RISC Microprocessor
PC755CMGHU350LE PowerPC 755/745 RISC Microprocessor
相關代理商/技術參數(shù)
參數(shù)描述
PC755BVGH300LE 制造商:e2v technologies 功能描述:PC755BVGH300LE - Trays
PC755BVGH350LE 制造商:e2v technologies 功能描述:POWERPC 755 32-BIT RISC MICROPROCESSOR - 350MHZ, 2.0V, HITCE, IND TEMP 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.22UM 350MHZ 2.5V/3.3V 360HITCE CBGA - Trays
PC755BVGU300LE 制造商:e2v technologies 功能描述:PC755BVGU300LE - Trays
PC755BVGU350LE 制造商:e2v technologies 功能描述:PC755BVGU350LE - Trays
PC755BVZFU300LD 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC