參數(shù)資料
型號: pentium III CPU
廠商: Intel Corp.
英文描述: Pentium III Processor for the SC242 at 450MHz to 1.0GHz(SC242工作頻率450MHZ到1GHZ奔III處理器)
中文描述: 奔騰III處理器在450MHz至1.0GHz的(SC242工作頻率至450MHz到1GHz的奔三處理器的SC242)
文件頁數(shù): 48/102頁
文件大?。?/td> 920K
代理商: PENTIUM III CPU
48
Datasheet
Pentium
III Processor for the SC242 at 450 MHz to 1.0 GHz
4.0
Thermal Specifications and Design Considerations
Limited quantities of Pentium
III
processors utilize S.E.C.C. package technology. This technology
uses an extended thermal plate for heatsink attachment. The extended thermal plate interface is
intended to provide accessibility for multiple types of thermal solutions. The majority of SC242-
based Pentium
III
processors use S.E.C.C.2 packaging technology. S.E.C.C.2 package technology
does not incorporate an extended thermal plate.
This chapter provides needed data for designing a thermal solution. However, for the correct
thermal measuring processes please refer to AP-905,
Pentium
III
Processor Thermal Design
Guidelines
(Order Number 245087).
Figure 18
provides a 3-dimensional view of an S.E.C.C. package. This figure illustrates the thermal
plate location.
Figure 19
provides a substrate view of an S.E.C.C.2 package.
Figure 18. S.E.C.Cartridge — 3-Dimensional View
Right Latch
Left Latch
Cover
Extended Thermal Plate
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