參數(shù)資料
型號: pentium III CPU
廠商: Intel Corp.
英文描述: Pentium III Processor for the SC242 at 450MHz to 1.0GHz(SC242工作頻率450MHZ到1GHZ奔III處理器)
中文描述: 奔騰III處理器在450MHz至1.0GHz的(SC242工作頻率至450MHz到1GHz的奔三處理器的SC242)
文件頁數(shù): 53/102頁
文件大?。?/td> 920K
代理商: PENTIUM III CPU
Datasheet
53
Pentium
III Processor for the SC242 at 450 MHz to 1.0 GHz
5.0
S.E.C.C. and S.E.C.C.2 Mechanical Specifications
Intel
Pentium
III
processors use either S.E.C.C. or S.E.C.C.2 package technology. Both package
types contain the processor core, L2 cache, and other passive components. The cartridges connect
to the baseboard through an edge connector. Mechanical specifications for the processor are given
in this section. See
Section 1.1.1
for a complete terminology listing.
5.1
S.E.C.C. Mechanical Specifications
S.E.C.C. package drawings and dimension details are provided in
Figure 21
through
Figure 30
.
Figure 21
shows multiple views of the Pentium
III
processor in an S.E.C.C. package;
Figure 22
through
Figure 25
show the package dimensions;
Figure 26
and
Figure 27
show the extended
thermal plate dimensions; and
Figure 28
and
Figure 29
provide details of the processor substrate
edge finger contacts.
Figure 30
and
Table 29
contain processor marking information. See
Section 5.2
for S.E.C.C.2 mechanical specifications.
The processor edge connector defined in this document is referred to as the “SC242 connector.”
See the
Slot 1 Connector Specification
(Order Number 243397) for further details on the SC242
connector.
Note:
For
Figure 21
through
Figure 43
, the following apply:
1. Unless otherwise specified, the following drawings are dimensioned in inches.
2. All dimensions provided with tolerances are guaranteed to be met for all normal production
product.
3. Figures and drawings labeled as “Reference Dimensions” are provided for informational
purposes only. Reference Dimensions are extracted from the mechanical design database and
are nominal dimensions with no tolerance information applied. Reference Dimensions are
NOT checked as part of the processor manufacturing. Unless noted as such, dimensions in
parentheses without tolerances are Reference Dimensions.
4. Drawings are not to scale.
Figure 21. S.E.C.C. Packaged Processor — Multiple Views
Left
Right
Right
Side
Left
Right
Thermal Plate
Side View
Cover Side view
Top View
Left Latch
Right Latch
Cover
Thermal
Plate
相關(guān)PDF資料
PDF描述
pentium III processor 32 bit Processor Mobile Module(32 位帶移動模塊處理器)
Pentium OverDrive Processor Pentium OverDrive Processor With MMX Technology For Pentium Processor-Based System(帶MMX技術(shù)奔騰超速轉(zhuǎn)動處理器)
pentium pro processor Pentium Pro Processor with 1MB L2 Cache at 200MHZ(1兆比特L2高速緩存頻率200兆赫茲處理器)
pentium processor with MMX 32-bit processor with MMX technology(32位帶MMX技術(shù)處理器)
pentium processor 32 Bit Processor With MMX And Mobile Module(32位帶移動模塊和MMX技術(shù)CPU)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
P-ENV568K3G3 制造商:Panasonic Industrial Company 功能描述:TUNER
PEO14012 制造商:TE Connectivity 功能描述:RELAY SPCO 12VDC
PEO14024 制造商:TE Connectivity 功能描述:RELAY SPCO 24VDC
PEO96742 制造商:Delphi Corporation 功能描述:ASM TERM
PEOODO3A 制造商:MACOM 制造商全稱:Tyco Electronics 功能描述:Versatile Power Entry Module with Small Footprint