參數(shù)資料
型號(hào)： pentium III CPU
廠商： Intel Corp.
英文描述： Pentium III Processor for the SC242 at 450MHz to 1.0GHz(SC242工作頻率450MHZ到1GHZ奔III處理器)
中文描述： 奔騰III處理器在450MHz至1.0GHz的（SC242工作頻率至450MHz到1GHz的奔三處理器的SC242）
文件頁(yè)數(shù)： 51/102頁(yè)
文件大小： 920K
代理商： PENTIUM III CPU
Datasheet
51
Pentium
III Processor for the SC242 at 450 MHz to 1.0 GHz
For S.E.C.C. packaged processors, the extended thermal plate is the attach location for all thermal
solutions. The maximum and minimum extended thermal plate temperatures are specified in
Table 25
. For S.E.C.C.2 packaged processors, thermal solutions attach to the processor by
connecting through the substrate to the cover. The maximum and minimum temperatures of the
pertinent locations are specified in
Table 26
. A thermal solution should be designed to ensure the
temperature of the specified locations never exceeds these temperatures.
The total processor power is a result of heat dissipated by the processor core and L2 cache. The
overall system chassis thermal design must comprehend the entire processor power. In S.E.C.C.
packaged processors, the extended thermal plate power is a component of this power, and is
primarily composed of the processor core and the L2 cache dissipating heat through the extended
thermal plate. The heatsink need only be designed to dissipate the extended thermal plate power.
See
Table 25
for current Pentium
III
processor S.E.C.C. thermal design specifications.
No extended thermal plate exists for S.E.C.C.2 packaged processors, so thermal solutions have to
attach directly to the processor core package. The total processor power dissipated by an S.E.C.C.2
processor is a combination of heat dissipated by both the processor core and L2 cache. Pentium
III
processors that use a “Discrete” L2 cache have a separate T
CASE
specification (
Table 26
) for the
surface mounted BSRAM components on the substrate. T
JUNCTION
encompasses the L2 cache for
processors that utilize the “Advanced Transfer Cache”, therefore no separate cache measurement is
required.
Specifics on how to measure these specifications are outlined in AP-905,
Pentium
III
Processor
Thermal Design Guidelines
(Order Number 245087).
Figure 20. Processor Functional Die Layout (CPUID 068xh)
Cache Area
0.05 in
2
0.362”
0.292”
0.170”
0.448”
Core Area
0.11 in
2
Die Area
0.16 in
2
Die Area = 1.05 cm
2
Cache Area = 0.32 cm
2
Core Area = 0.73 cm
2
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