參數(shù)資料
型號(hào)： RTL8309SB
廠商： Electronic Theatre Controls, Inc.
英文描述： SINGLE-CHIP 9-PORT 10/100MBPS SWITCH CONTROLLER
中文描述： 單芯片9口10/100Mbps開(kāi)關(guān)控制器
文件頁(yè)數(shù)： 109/115頁(yè)
文件大小： 866K
代理商： RTL8309SB
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RTL8309SB
Datasheet
Single-chip 9-port 10/100Mbps Switch Controller
94
Track ID: JATR-1076-21 Rev. 1.4
Parameter
MTXD/PRXD[0],
MTXEN/PRXDV,
MCOL/PCOL Hold Time
SYM
T
h
Condition
I/O Min
I
Type Max
Units
ns
MTXD[0]/PRXD[0], MRXDV/PTXEN to
REFCLK rising edge hold time
2
LED Timing
LED On Time
LED Off Time
tLEDon While LED blinking
tLEDoff While LED blinking
O
O
43
43
-
-
120
120
ms
ms
9.6.
Thermal Characteristics
Heat generated by the chip causes a temperature rise of the package. If the temperature of the chip (Tj, junction temperature) is
beyond the design limits, there will be negative effects on operation and the life of the IC package. Heat dissipation, either
through a heat sink or electrical fan, is necessary to provide a reasonable environment (Ta, ambient temperature) in a closed
case. As power density increases, thermal management becomes more critical. A method to estimate the possible Ta is outlined
below.
Thermal parameters are defined as below according to JEDEC standard JESD 51-2, 51-6:
1.
θ
ja (Thermal resistance from junction to ambient), represents resistance to heat flow from the chip to ambient air. This is
an index of heat dissipation capability. A lower
θ
ja means better thermal performance.
θ
ja = (Tj - Ta) / Ph
Where Tj is the junction temperature
Ta is the ambient temperature
Ph is the power dissipation
2.
θ
jc (Thermal resistance from junction to case), represents resistance to heat flow from the chip to the package top case.
θ
jc is important when an external heat sink is attached on the package top.
θ
jc = (Tj - Tc) / Ph, where Tj is the junction temperature
Figure 22. Cross-section of 128-Pin PQFP
Table 119. Thermal Operating Range
Condition
Parameter
Junction operating
temperature
Ambient operating
temperature
SYM
Tj
Min Typical Max
0
25
Units
°
C
125
Ta
0
25
70
°
C
Ta
Tj
Tc
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