參數(shù)資料
型號: TMS320VC5409GGU-80
廠商: Texas Instruments
文件頁數(shù): 87/93頁
文件大?。?/td> 0K
描述: IC FIXED POINT DSP 144-BGA
標(biāo)準(zhǔn)包裝: 160
系列: TMS320C54x
類型: 定點(diǎn)
接口: 主機(jī)接口,McBSP
時(shí)鐘速率: 80MHz
非易失內(nèi)存: ROM(32 kB)
芯片上RAM: 64kB
電壓 - 輸入/輸出: 3.30V
電壓 - 核心: 1.80V
工作溫度: -40°C ~ 100°C
安裝類型: 表面貼裝
封裝/外殼: 144-LFBGA
供應(yīng)商設(shè)備封裝: 144-BGA MICROSTAR(12x12)
包裝: 托盤
配用: 296-15829-ND - DSP STARTER KIT FOR TMS320C5416
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
TMS320VC5409GGU-80
ACTIVE
BGA
MICROSTAR
GGU
144
160
Green (RoHS
& no Sb/Br)
SNPB
Level-1-260C-UNLIM
-40 to 100
DVC5409GGU
80
TMS320VC5409GGU100
ACTIVE
BGA
MICROSTAR
GGU
144
160
TBD
SNPB
Level-3-220C-168 HR
-40 to 100
DVC5409GGU
100
TMS320VC5409PGE-80
ACTIVE
LQFP
PGE
144
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 100
PGE-80
TMS320VC5409
TMS320VC5409PGE100
ACTIVE
LQFP
PGE
144
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 100
PGE100
TMS320VC5409
TMS320VC5409ZGU-80
ACTIVE
BGA
MICROSTAR
ZGU
144
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 100
DVC5409ZGU
-80
TMS320VC5409ZGU100
ACTIVE
BGA
MICROSTAR
ZGU
144
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 100
DVC5409ZGU
100
TMS320VC5409ZGUR80
OBSOLETE
BGA
MICROSTAR
ZGU
144
TBD
Call TI
-40 to 100
DVC5409ZGU
-80
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
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