參數(shù)資料
型號: TMS570LS10216ASZWTQR
廠商: TEXAS INSTRUMENTS INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, FLASH, 160 MHz, RISC MICROCONTROLLER, PBGA337
封裝: GERRN, PLASTIC, NFBGA-337
文件頁數(shù): 4/102頁
文件大小: 1146K
代理商: TMS570LS10216ASZWTQR
PRODUCTPREVIEW
www.ti.com
SPNS141D – AUGUST 2010 – REVISED JANUARY 2011
9
Mechanical Packaging and Orderable Information
The following table(s) show the thermal resistance for the PBGA-ZWT and PQFP-PGE mechanical
packages.
9.1
Thermal Data
9.1.1
PGE (S-PQFP-G144) plastic Quad Flat Pack
Table 9-1. PGE (S-PQFP-G144) Thermal Resistance Characteristics
PARAMETER
°C / W
RΘJA
45
RΘJC
5
9.1.2
ZWT (S-PBGA-N337) Plastic ball grid array
Table 9-2. ZWT (S-PBGA-N337) Thermal Resistance Characteristics
PARAMETER
°C / W
RΘJA
22
RΘJC
3.3
9.2
Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). The data is subject to change without notice and without revision of this document.
Copyright 2010–2011, Texas Instruments Incorporated
Mechanical Packaging and Orderable Information
101
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