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5.3 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating
Case Temperature (Unless Otherwise Noted)
TMS320DM6443
Digital Media System-on-Chip
SPRS282E–DECEMBER 2005–REVISED MARCH 2007
PARAMETER
TEST CONDITIONS
(1)
MIN
TYP
MAX
UNIT
Low/full speed:
USB_DN and USB_DP
2.8
USB_V
DDAP3
V
High speed:
USB_DN and USB_DP
360
440
mV
V
OH
High-level output voltage (3.3V I/O)
DV
DD33
= MIN, I
OH
= MAX
DV
DD18
= MIN, I
OH
= MAX
2.4
V
High-level output voltage (1.8V I/O)
DV
DD
- 0.45
V
Low/full speed:
USB_DN and USB_DP
0.0
0.3
V
High speed:
USB_DN and USB_DP
-10
10
mV
V
OL
Low-level output voltage (3.3V I/O)
DV
DD33
= MIN, I
OL
= MAX
DV
DD18
= MIN, I
OL
= MAX
V
= V
to DV
DD
without opposing
internal resistor
0.4
V
Low-level output voltage (1.8V I/O)
0.45
V
±
10
μ
A
V
= V
to DV
DD
with opposing internal
pullup resistor
(3)
I
I(2)
Input current
50
100
250
μ
A
V
= V
to DV
with opposing internal
pulldown resistor
-250
-100
-50
μ
A
I
OH
I
OL
High-level output current
All peripherals
-4
mA
Low-level output current
All peripherals
4
mA
V
O
= DV
DD
or V
SS
; internal pull disabled
V
O
= DV
DD
or V
SS
; internal pull enabled
±
20
μ
A
μ
A
I
OZ(4)
I/O Off-state output current
±
100
Core (CV
, V
, V
DDA1P2LDO(5)
,
CV
DDDSP
) supply current
(6)
3.3V I/O (DV
DD33
, USB_V
DDA3P3
) supply
current
(6)
I
CDD
CV
DD
= 1.2 V, DSP clock = 594 MHz
767
mA
I
DDD
DV
DD
= 3.3 V, DSP clock = 594 MHz
6
mA
1.8V I/O (DV
DD18
, DV
, DDR_V
,
PLLV
, V
, USB_V
DD1P8
, MXVDD,
M24VDD) supply current
(6)
I
DDD
DV
DD
= 1.8 V, DSP clock = 594 MHz
102
mA
C
I
C
o
Input capacitance
4
pF
Output capacitance
4
pF
(1)
(2)
For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table.
I
applies to input-only pins and bi-directional pins. For input-only pins, I
indicates the input leakage current. For bi-directional pins, I
I
indicates the input leakage current and off-state (Hi-Z) output leakage current.
Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor.
I
applies to output-only pins, indicating off-state (Hi-Z) output leakage current.
This pin is an internal LDO output and connected via 1
μ
F capacitor to USB_V
.
Measured under the following conditions: 60% DSP CPU utilization; ARM doing typical activity (peripheral configurations, other
housekeeping activities); DDR2 Memory Controller at 50% utilization (135 MHz), 50% writes, 32 bits, 50% bit switching; 2 MHz ASP at
100% utilization; Timer0 at 100% utilization. At room temperature (25
°
C) for typical process devices. The actual current draw varies
across manufacturing processes and is highly application-dependent. For more details on core and I/O activity, as well as information
relevant to board power supply design, see the
TMS320DM644x Power Consumption Summary
application report (literature number
SPRAAD6
).
(3)
(4)
(5)
(6)
86
Device Operating Conditions
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