參數(shù)資料
型號: TTRN0110G
英文描述: ATM MULTIPLEXER|BGA|198PIN|CERAMIC
中文描述: ATM多路復(fù)用器|的BGA | 198PIN |陶瓷
文件頁數(shù): 27/30頁
文件大?。?/td> 578K
代理商: TTRN0110G
Agere Systems Inc.
27
Data Sheet
March 29, 2002
10 Gbits/s Clock Synthesizer, 16:1 Data Multiplexer
TTRN0110G
Packaging Characteristics
Package Crush Characteristics
Table 22. Crush Specifications
Additional test information available upon request.
CBGA Package Information
The package used for the TTRN0110G is a ceramic ball grid array (CBGA). The substrate is 99.6% alumina
(Al2O3) material. The standoff height is accomplished by using 0.013 in. diameter copper silver (CuAg) balls,
which are attached using a eutectic braze to the thin film metal pads on the substrate. After brazing, the balls have
a diameter at the braze fillet of 0.016 in. (at the interface of the ball and substrate), but still maintain their height of
0.013 in. for standoff height.
PWB Design Information
The layout of the bare PWB should use a 0.016 in. diameter pad. The pad should be defined by the copper and not
by solder mask. (The only copper leading away from the pad should be the trace connected to it; the pad should
not be part of a large ground plane unless only connected to the ground plane by a single trace.) Avoid placement
of vias in the pads used for ball attachment on the PWB. Vias should be connected by a trace (or tear dropped)
with a sufficient dam of solder mask to prevent solder from wicking into the via and away from the ball/PWB solder
joint.
The stencil opening should be designed at 0.016 in. as well, to match up with the CBGA pads.
Device Code
TTRN0110G
Package
198-ball CBGA
Dimensions
15 mm x 15 mm
Conditions
Without pad
With pad (0.040 in.)
Min
Typ
25
25
Max
Unit
lbs
lbs
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