參數(shù)資料
型號(hào): W25X10BVSNIG
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 1M X 1 FLASH 2.7V PROM, PDSO8
封裝: 0.150 INCH, GREEN, PLASTIC, SOIC-8
文件頁(yè)數(shù): 43/51頁(yè)
文件大?。?/td> 1632K
代理商: W25X10BVSNIG
W25X10BV/20BV/40BV
- 48 -
8-Pad WSON 6x5mm Cont’d.
MILLIMETERS
INCHES
SYMBOL
.
MIN
TYP.
MAX
MIN
TYP
MAX
SOLDER PATTERN
M
3.40
0.
38
13
N
4.30
0.
92
16
P
6.00
0.
60
23
Q
0.50
0.
96
01
R
0.75
0.
55
02
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid
placement of exposed PCB vias under the pad.
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