- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄3910 > 101-0497 (Rabbit Semiconductor)MODULAR RABBIT CORE OP6810 PDF資料下載
參數(shù)資料
| 型號： | 101-0497 |
| 廠商： | Rabbit Semiconductor |
| 文件頁數(shù)： | 39/110頁 |
| 文件大?。?/td> | 0K |
| 描述： | MODULAR RABBIT CORE OP6810 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | RabbitCore® |
| 模塊/板類型： | 單板計算機模塊 |
| 適用于相關(guān)產(chǎn)品： | OP6810 |
| 其它名稱： | Q1912584 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁當(dāng)前第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁
30
MiniCom (OP6800)
Developing software with Dynamic C is simple. Users can write, compile, and test C and
assembly code without leaving the Dynamic C development environment. Debugging
occurs while the application runs on the target. Alternatively, users can compile a program
to a binary image file for later loading. Dynamic C runs on PCs under Windows 95 or
later. Programs can be downloaded at baud rates of up to 230,000 bps after the program
compiles.
Dynamic C has a number of standard features.
Full-feature source and/or assembly-level debugger, no in-circuit emulator required.
Royalty-free TCP/IP stack with source code and most common protocols.
Hundreds of functions in source-code libraries and sample programs:
Exceptionally fast support for floating-point arithmetic and transcendental functions.
RS-232 and RS-485 serial communication.
Analog and digital I/O drivers.
I
2C, SPI, GPS, file system.
LCD display and keypad drivers.
Powerful language extensions for cooperative or preemptive multitasking
Loader utility program to load binary images into Rabbit targets in the absence of
Dynamic C.
Provision for customers to create their own source code libraries and augment on-line
help by creating “function description” block comments using a special format for
library functions.
Standard debugging features:
Breakpoints—Set breakpoints that can disable interrupts.
Single-stepping—Step into or over functions at a source or machine code level, C/OS-II aware.
Code disassembly—The disassembly window displays addresses, opcodes, mnemonics, and
machine cycle times. Switch between debugging at machine-code level and source-code level by
simply opening or closing the disassembly window.
Watch expressions—Watch expressions are compiled when defined, so complex expressions
including function calls may be placed into watch expressions. Watch expressions can be updated
with or without stopping program execution.
Register window—All processor registers and flags are displayed. The contents of general registers
may be modified in the window by the user.
Stack window—shows the contents of the top of the stack.
Hex memory dump—displays the contents of memory at any address.
STDIO window—printf outputs to this window and keyboard input on the host PC can be
detected for debugging purposes. printf output may also be sent to a serial port or file.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 18FMN-BMTTN-A-TF | CONN FMN HSNG 18POS STAG NOR SMD |
| 101-0599 | COMPUTER SNGLBD BL2500 512K FLSH |
| 20-101-0497 | MODULE OP6810 W/O ETH/MEM EXPANS |
| 20-101-0464 | COMPUTER SINGLE-BOARD BL2130 |
| SOMOMAP3503-21-1670AGCR | SYSTEM ON MODULE LV OMAP3503 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 10104997-00C-10B | 功能描述:高速/模塊連接器 XCEDE 2W 6PVH 6COL RoHS:否 制造商:Molex 系列:iPass 產(chǎn)品類型: 排數(shù): 列數(shù): 位置/觸點數(shù)量:38 安裝角:Right 節(jié)距:0.8 mm 安裝風(fēng)格:Plug 端接類型:SMD/SMT 外殼材料:Thermoplastic 觸點材料:High Performance Alloy (HPA) 觸點電鍍:Gold |
| 10104997-00C-10DLF | 功能描述:高速/模塊連接器 XCEDE 2W 6PVH 6COL RoHS:否 制造商:Molex 系列:iPass 產(chǎn)品類型: 排數(shù): 列數(shù): 位置/觸點數(shù)量:38 安裝角:Right 節(jié)距:0.8 mm 安裝風(fēng)格:Plug 端接類型:SMD/SMT 外殼材料:Thermoplastic 觸點材料:High Performance Alloy (HPA) 觸點電鍍:Gold |
| 10104997-00C-20B | 功能描述:高速/模塊連接器 XCEDE 2W LT 6PVH6COL RoHS:否 制造商:Molex 系列:iPass 產(chǎn)品類型: 排數(shù): 列數(shù): 位置/觸點數(shù)量:38 安裝角:Right 節(jié)距:0.8 mm 安裝風(fēng)格:Plug 端接類型:SMD/SMT 外殼材料:Thermoplastic 觸點材料:High Performance Alloy (HPA) 觸點電鍍:Gold |
| 10104997-00C-20DLF | 功能描述:高速/模塊連接器 XCEDE 2W 6PVH 6COL XCEDE 2 WALL HEADER RoHS:否 制造商:Molex 系列:iPass 產(chǎn)品類型: 排數(shù): 列數(shù): 位置/觸點數(shù)量:38 安裝角:Right 節(jié)距:0.8 mm 安裝風(fēng)格:Plug 端接類型:SMD/SMT 外殼材料:Thermoplastic 觸點材料:High Performance Alloy (HPA) 觸點電鍍:Gold |
| 10104997-00C-30B | 功能描述:高速/模塊連接器 XCEDE 6PR 6COL 2WALL RoHS:否 制造商:Molex 系列:iPass 產(chǎn)品類型: 排數(shù): 列數(shù): 位置/觸點數(shù)量:38 安裝角:Right 節(jié)距:0.8 mm 安裝風(fēng)格:Plug 端接類型:SMD/SMT 外殼材料:Thermoplastic 觸點材料:High Performance Alloy (HPA) 觸點電鍍:Gold |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。