The functions used to control the keypad are in the KEYPAD7.LIB
參數(shù)資料
型號： 101-0497
廠商： Rabbit Semiconductor
文件頁數(shù)： 4/110頁
文件大?。?/td> 0K
描述： MODULAR RABBIT CORE OP6810
標(biāo)準(zhǔn)包裝： 1
系列： RabbitCore®
模塊/板類型： 單板計(jì)算機(jī)模塊
適用于相關(guān)產(chǎn)品： OP6810
其它名稱： Q1912584
User’s Manual
97
D.5.1 Keypad
The functions used to control the keypad are in the KEYPAD7.LIB library located in the
Dynamic C LIB\KEYPADS library folder.
Initializes keypad process
RETURN VALUE
None.
SEE ALSO
brdInit
Assigns each key with key press and release codes, and hold and repeat ticks for auto repeat and
debouncing.
PARAMETERS
cRaw
is a raw key code index.
1 × 7 keypad matrix with raw key code index assignments (in brackets):
User Keypad Interface
cPress
is a key press code
An 8-bit value is returned when a key is pressed.
0 = Unused.
See keypadDef() for default press codes.
cRelease
is a key release code.
An 8-bit value is returned when a key is pressed.
0 = Unused.
cCntHold
is a hold tick, which is approximately one debounce period or 5 s.
How long to hold before repeating.
0 = No Repeat.
cSpdLo
is a low-speed repeat tick, which is approximately one debounce period or 5 s.
How many times to repeat.
0 = None.
cCntLo
is a low-speed hold tick, which is approximately one debounce period or 5 s.
How long to hold before going to high-speed repeat.
0 = Slow Only.
void keyInit(void);
void keyConfig(char cRaw, char cPress,
char cRelease, char cCntHold, char cSpdLo,
char cCntLo, char cSpdHi);
[0]
[1]
[2]
[3]
[4]
[5]
[6]
相關(guān)PDF資料
PDF描述
18FMN-BMTTN-A-TF CONN FMN HSNG 18POS STAG NOR SMD
101-0599 COMPUTER SNGLBD BL2500 512K FLSH
20-101-0497 MODULE OP6810 W/O ETH/MEM EXPANS
20-101-0464 COMPUTER SINGLE-BOARD BL2130
SOMOMAP3503-21-1670AGCR SYSTEM ON MODULE LV OMAP3503
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
10104997-00C-10B 功能描述:高速/模塊連接器 XCEDE 2W 6PVH 6COL RoHS:否 制造商:Molex 系列:iPass 產(chǎn)品類型: 排數(shù): 列數(shù): 位置/觸點(diǎn)數(shù)量:38 安裝角:Right 節(jié)距:0.8 mm 安裝風(fēng)格:Plug 端接類型:SMD/SMT 外殼材料:Thermoplastic 觸點(diǎn)材料:High Performance Alloy (HPA) 觸點(diǎn)電鍍:Gold
10104997-00C-10DLF 功能描述:高速/模塊連接器 XCEDE 2W 6PVH 6COL RoHS:否 制造商:Molex 系列:iPass 產(chǎn)品類型: 排數(shù): 列數(shù): 位置/觸點(diǎn)數(shù)量:38 安裝角:Right 節(jié)距:0.8 mm 安裝風(fēng)格:Plug 端接類型:SMD/SMT 外殼材料:Thermoplastic 觸點(diǎn)材料:High Performance Alloy (HPA) 觸點(diǎn)電鍍:Gold
10104997-00C-20B 功能描述:高速/模塊連接器 XCEDE 2W LT 6PVH6COL RoHS:否 制造商:Molex 系列:iPass 產(chǎn)品類型: 排數(shù): 列數(shù): 位置/觸點(diǎn)數(shù)量:38 安裝角:Right 節(jié)距:0.8 mm 安裝風(fēng)格:Plug 端接類型:SMD/SMT 外殼材料:Thermoplastic 觸點(diǎn)材料:High Performance Alloy (HPA) 觸點(diǎn)電鍍:Gold
10104997-00C-20DLF 功能描述:高速/模塊連接器 XCEDE 2W 6PVH 6COL XCEDE 2 WALL HEADER RoHS:否 制造商:Molex 系列:iPass 產(chǎn)品類型: 排數(shù): 列數(shù): 位置/觸點(diǎn)數(shù)量:38 安裝角:Right 節(jié)距:0.8 mm 安裝風(fēng)格:Plug 端接類型:SMD/SMT 外殼材料:Thermoplastic 觸點(diǎn)材料:High Performance Alloy (HPA) 觸點(diǎn)電鍍:Gold
10104997-00C-30B 功能描述:高速/模塊連接器 XCEDE 6PR 6COL 2WALL RoHS:否 制造商:Molex 系列:iPass 產(chǎn)品類型: 排數(shù): 列數(shù): 位置/觸點(diǎn)數(shù)量:38 安裝角:Right 節(jié)距:0.8 mm 安裝風(fēng)格:Plug 端接類型:SMD/SMT 外殼材料:Thermoplastic 觸點(diǎn)材料:High Performance Alloy (HPA) 觸點(diǎn)電鍍:Gold
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*