December 16, 2005
Am29LV2562M
3
D A T A S H E E T
TABLE OF CONTENTS
Product Selector Guide. . . . . . . . . . . . . . . . . . . . . 4
MCP Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . 4
Flash Memory Block diagram. . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6
Special Package Handling Instructions ....................................6
Pin Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
x16 Mode ..................................................................................7
x32 Mode ..................................................................................7
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . 8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 9
Table 1. Device Bus Operations....................................................... 9
Word/Byte Configuration ..........................................................9
VersatileIO
TM
(V
IO
) Control .......................................................9
Requirements for Reading Array Data ...................................10
Page Mode Read ............................................................................10
Writing Commands/Command Sequences ............................10
Write Buffer .....................................................................................10
Accelerated Program Operation ......................................................10
Autoselect Functions .......................................................................10
Standby Mode ........................................................................10
Automatic Sleep Mode ...........................................................11
RESET#: Hardware Reset Pin ...............................................11
Output Disable Mode ..............................................................11
Table 2. Sector Address Table........................................................ 12
Autoselect Mode .....................................................................24
Table 3. Autoselect Codes, (High Voltage Method) ....................... 24
Sector Group Protection and Unprotection .............................25
Table 4. Sector Group Protection/Unprotection AddressTable ..... 25
Write Protect (WP#) ................................................................27
Temporary Sector Group Unprotect .......................................27
Figure 1. Temporary Sector Group UnprotectOperation ................27
Figure 2. In-System Sector Group Protect/UnprotectAlgorithms ...28
SecSi (Secured Silicon) Sector Flash MemoryRegion ..........29
Table 5. SecSi Sector Contents...................................................... 29
Figure 3. SecSi Sector Protect Verify ..............................................30
Hardware Data Protection ......................................................30
Low VCC Write Inhibit .....................................................................30
Write Pulse “Glitch” Protection ........................................................30
Logical Inhibit ..................................................................................30
Power-Up Write Inhibit ....................................................................30
Common Flash Memory Interface (CFI). . . . . . . 30
Table 6. CFI Query Identification String ..........................................31
Table 7. System Interface String..................................................... 31
Table 8. Device Geometry Definition ..............................................32
Table 9. Primary Vendor-Specific Extended Query ........................33
Command Definitions . . . . . . . . . . . . . . . . . . . . . 34
Reading Array Data ................................................................34
Reset Command .....................................................................34
Autoselect Command Sequence ............................................34
Enter SecSi Sector/Exit SecSi Sector CommandSequence ..35
Doubleword/Word Program Command Sequence .................35
Unlock Bypass Command Sequence ..............................................35
Write Buffer Programming ...............................................................35
Accelerated Program ......................................................................36
Figure 4. Write Buffer Programming Operation ...............................37
Figure 5. Program Operation ..........................................................38
Program Suspend/Program Resume Command Sequence ...38
Figure 6. Program Suspend/Program Resume ..............................39
Chip Erase Command Sequence ...........................................39
Sector Erase Command Sequence ........................................39
Figure 7. Erase Operation ..............................................................40
Erase Suspend/Erase Resume Commands ...........................40
Command Definitions .............................................................41
Table 10. Command Definitions (x32 Mode, WORD# = V
IH
)......... 41
Table 11. Command Definitions (x16 Mode, WORD# = V
).......... 42
Write Operation Status. . . . . . . . . . . . . . . . . . . . . 43
DQ7 and DQ5: Data# Polling ..................................................43
Figure 7. Data# Polling Algorithm ..................................................43
RY/BY#: Ready/Busy# ............................................................44
DQ6 and DQ14: Toggle Bits I .................................................44
Figure 8. Toggle Bit Algorithm ........................................................44
DQ2 and DQ10: Toggle Bits II ................................................45
Reading Toggle Bits DQ6 and DQ14/DQ2 and DQ10 ............45
DQ5 and DQ13: Exceeded Timing Limits ...............................45
DQ3 and DQ11: Sector Erase Timer ......................................45
DQ1: Write-to-Buffer Abort .....................................................46
Table 12. Write Operation Status................................................... 46
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 47
Figure 9. Maximum Negative OvershootWaveform .....................47
Figure 10. Maximum Positive OvershootWaveform .....................47
Operating Ranges. . . . . . . . . . . . . . . . . . . . . . . . . 47
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 48
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Figure 11. Test Setup .....................................................................49
Table 13. Test Specifications......................................................... 49
Key to Switching Waveforms. . . . . . . . . . . . . . . . 49
Figure 12. Input Waveforms and
Measurement Levels ......................................................................49
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 50
Read-Only Operations ...........................................................50
Figure 13. Read Operation Timings ...............................................50
Figure 14. Page Read Timings ......................................................51
Hardware Reset (RESET#) ....................................................52
Figure 15. Reset Timings ...............................................................52
Erase and Program Operations ..............................................53
Figure 16. Program Operation Timings ..........................................54
Figure 17. Accelerated Program Timing Diagram ..........................54
Figure 18. Chip/Sector Erase Operation Timings ..........................55
Figure 19. Data# Polling Timings (During Embedded Algorithms) .56
Figure 20. Toggle Bit Timings (During Embedded Algorithms) ......57
Figure 21. DQ2 vs. DQ6 .................................................................57
Temporary Sector Unprotect ..................................................58
Figure 22. Temporary Sector Group Unprotect TimingDiagram ...58
Figure 23. Sector Group Protect and Unprotect TimingDiagram ..59
Alternate CE# Controlled Erase and ProgramOperations .....60
Figure 24. Alternate CE# Controlled Write (Erase/Program)
OperationTimings ..........................................................................61
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 61
Erase And Programming Performance. . . . . . . . 62
TSOP Pin and BGA Package Capacitance . . . . . 62
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 63
LSC080–80-Ball Fortified Ball Grid Array
18 x 12 mm Package ..............................................................63
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 64