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參數(shù)資料
| 型號(hào)： | APMOTOR56F8000E |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 25/124頁 |
| 文件大?。?/td> | 0K |
| 描述： | KIT DEMO MOTOR CTRL SYSTEM |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 附件類型： | 電機(jī)控制器 |
| 適用于相關(guān)產(chǎn)品： | DEMO56F8013，DEMO56F8013-E |
| 相關(guān)產(chǎn)品： | MC56F8006VWL-ND - DSC 16K FLASH 32MHZ 28-SOIC MC56F8006VLF-ND - DSC 16K FLASH 32MHZ 48-LQFP MC56F8006VLC-ND - DSC 16K FLASH 32MHZ 32-LQFP MC56F8002VWL-ND - DSC 12K FLASH 32MHZ 28-SOIC DEMO56F8014-E-ND - BOARD DEMO MC56F8014 W/UNIV PS DEMO56F8014-ND - BOARD DEMO MC56F8014 W/US PS DEMO56F8014-EE-ND - BOARD DEMO FOR 56F8014 DEMO56F8013-EE-ND - BOARD DEMO FOR 56F8013 MC56F8014VFAE-ND - IC DIGITAL SIGNAL CTRLR 32-LQFP MC56F8013VFAE-ND - IC DIGITAL SIGNAL CTLR 32-LQFP 更多... |
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56F8014 Technical Data, Rev. 11
120
Freescale Semiconductor
Part 12 Design Considerations
12.1 Thermal Design Considerations
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJΑ x PD)
where
:
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Unfortunately, there are two values in common usage: the value
determined on a single-layer board and the value obtained on a board with two planes. For packages such
as the PBGA, these values can be different by a factor of two. Which value is closer to the application
depends on the power dissipated by other components on the board. The value obtained on a single layer
board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the
internal planes is usually appropriate if the board has low-power dissipation and the components are well
separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where
:
RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case to ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the
Thermal Characterization Parameter (
Ψ
JT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT x PD)
where
:
TA
=
Ambient temperature for the package (oC)
RθJΑ = Junction-to-ambient thermal resistance (
oC/W)
PD
=
Power dissipation in the package (W)
RθJA = Package junction-to-ambient thermal resistance (°C/W)
RθJC = Package junction-to-case thermal resistance (°C/W)
RθCA = Package case-to-ambient thermal resistance (°C/W)
TT
=
Thermocouple temperature on top of package (oC)
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