參數(shù)資料
型號： IS43R16160A-6T
廠商： INTEGRATED SILICON SOLUTION INC
元件分類： DRAM
英文描述： 16Meg x 16 256-MBIT DDR SDRAM
中文描述： 16M X 16 DDR DRAM, 0.7 ns, PDSO66
封裝： PLASTIC, TSOP2-66
文件頁數(shù)： 8/56頁
文件大小： 792K
代理商： IS43R16160A-6T
8
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. 00B
11/28/05
ISSI
IS43R16160A
Bank Activate Command
The Bank Activate command is issued by holding CAS and WE high with CS and RAS low at the rising
edge of the clock. The DDR SDRAM has four independent banks, so two Bank Select addresses (BA
0
and
BA
1
) are supported. The Bank Activate command must be applied before any Read or Write operation can
be executed. The delay from the Bank Activate command to the first Read or Write command must meet or
exceed the minimum RAS to CAS delay time (t
RCD
min). Once a bank has been activated, it must be pre-
charged before another Bank Activate command can be applied to the same bank. The minimum time interval
between interleaved Bank Activate commands (Bank A to Bank B and vice versa) is the Bank to Bank delay
time (t
RRD
min).
Bank Activation Timing
Read Operation
With the DLL enabled, all devices operating at the same frequency within a system are ensured to have
the same timing relationship between DQ and DQS relative to the CK input regardless of device density, pro-
cess variation, or technology generation.
The data strobe signal (DQS) is driven off chip simultaneously with the output data (DQ) during each read
cycle. The same internal clock phase is used to drive both the output data and data strobe signal off chip to
minimize skew between data strobe and output data. This internal clock phase is nominally aligned to the
input differential clock (CK, CK) by the on-chip DLL. Therefore, when the DLL is enabled and the clock fre-
quency is within the specified range for proper DLL operation, the data strobe (DQS), output data (DQ), and
the system clock (CK) are all nominally aligned.
Since the data strobe and output data are tightly coupled in the system, the data strobe signal may be de-
layed and used to latch the output data into the receiving device. The tolerance for skew between DQS and
DQ (t
DQSQ
) is tighter than that possible for CK to DQ (t
AC
) or DQS to CK (t
DQSCK
).
T0
T1
T2
T3
Tn
Tn+1
Tn+2
Tn+3
Tn+4
Tn+5
(CAS Latency = 2; Burst Length = Any)
t
RRD
(min)
t
RP
(min)
t
RC
t
RCD
(min)
Begin Precharge Bank A
CK, CK
BA/Address
Command
Bank/Col
Read/A
Bank/Row
Activate/A
Activate/B
Pre/A
Bank/Row
Activate/A
Bank
Bank/Row
t
RAS
(min)
相關(guān)PDF資料
PDF描述
IS43R16160A 16Meg x 16 256-MBIT DDR SDRAM
IS43R16320A 32Meg x 16 512-MBIT DDR SDRAM
IS43R16320A-6TL 32Meg x 16 512-MBIT DDR SDRAM
IS43R16800A-6 8Meg x 16 128-MBIT DDR SDRAM
IS43R16800A-6T 8Meg x 16 128-MBIT DDR SDRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IS43R16160B 制造商:ISSI 制造商全稱:Integrated Silicon Solution, Inc 功能描述:32Mx8, 16Mx16 256Mb DDR Synchronous DRAM
IS43R16160B-5BI 制造商:ISSI 制造商全稱:Integrated Silicon Solution, Inc 功能描述:32Mx8, 16Mx16 256Mb DDR Synchronous DRAM
IS43R16160B-5BL 功能描述:動態(tài)隨機(jī)存取存儲器 256M (16Mx16) 400MHz DDR 2.5v RoHS:否 制造商:ISSI 數(shù)據(jù)總線寬度:16 bit 組織:1 M x 16 封裝 / 箱體:SOJ-42 存儲容量:16 MB 最大時鐘頻率: 訪問時間:50 ns 電源電壓-最大:7 V 電源電壓-最小:- 1 V 最大工作電流:90 mA 最大工作溫度:+ 85 C 封裝:Tube
IS43R16160B-5BLI 功能描述:動態(tài)隨機(jī)存取存儲器 256M (16Mx16) 400MHz DDR 2.5v RoHS:否 制造商:ISSI 數(shù)據(jù)總線寬度:16 bit 組織:1 M x 16 封裝 / 箱體:SOJ-42 存儲容量:16 MB 最大時鐘頻率: 訪問時間:50 ns 電源電壓-最大:7 V 電源電壓-最小:- 1 V 最大工作電流:90 mA 最大工作溫度:+ 85 C 封裝:Tube
IS43R16160B-5BLI-TR 功能描述:動態(tài)隨機(jī)存取存儲器 256M (16Mx16) 400MHz DDR 2.5v RoHS:否 制造商:ISSI 數(shù)據(jù)總線寬度:16 bit 組織:1 M x 16 封裝 / 箱體:SOJ-42 存儲容量:16 MB 最大時鐘頻率: 訪問時間:50 ns 電源電壓-最大:7 V 電源電壓-最小:- 1 V 最大工作電流:90 mA 最大工作溫度:+ 85 C 封裝:Tube
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