參數(shù)資料
型號: K4T1G044QQ-HC(L)E6
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 1Gb Q-die DDR2 SDRAM Specification
中文描述: 1Gb的調(diào)Q DDR2內(nèi)存芯片規(guī)格
文件頁數(shù): 21/44頁
文件大?。?/td> 891K
代理商: K4T1G044QQ-HC(L)E6
K4T1G084QQ
K4T1G164QQ
Rev. 1.01 November 2007
DDR2 SDRAM
21 of 44
K4T1G044QQ
14.0 General notes, which may apply for all AC parameters
1. DDR2 SDRAM AC timing reference load
Figure 1 represents the timing reference load used in defining the relevant timing parameters of the part. It is not intended to be either a precise repre
sentation of the typical system environment or a depiction of the actual load presented by a production tester. System designers will use IBIS or other
simulation tools to correlate the timing reference load to a system environment. Manufacturers will correlate to their production test conditions (generally
a coaxial transmission line terminated at the tester electronics).
The output timing reference voltage level for single ended signals is the crosspoint with VTT. The output timing reference voltage level for differential
signals is the crosspoint of the true (e.g. DQS) and the complement (e.g. DQS) signal.
2. Slew Rate Measurement Levels
a) Output slew rate for falling and rising edges is measured between VTT - 250 mV and VTT + 250 mV for single ended signals. For differential signals
(e.g. DQS - DQS) output slew rate is measured between DQS - DQS = - 500 mV and DQS - DQS = + 500 mV. Output slew rate is guaranteed by
design, but is not necessarily tested on each device.
b) Input slew rate for single ended signals is measured from Vref(dc) to VIH(ac),min for rising edges and from Vref(dc) to VIL(ac),max for falling edges.
For differential signals (e.g. CK - CK) slew rate for rising edges is measured from CK - CK = - 250 mV to CK - CK = + 500 mV (+ 250 mV to - 500 mV
for falling edges).
c) VID is the magnitude of the difference between the input voltage on CK and the input voltage on CK, or between DQS and DQS for differential strobe.
3. DDR2 SDRAM output slew rate test load
Output slew rate is characterized under the test conditions as shown in Figure 2.
VDDQ
DUT
DQ
DQS
DQS
RDQS
RDQS
Output
V
TT
= V
DDQ
/2
25
Timing
reference
point
Figure 1 - AC Timing Reference Load
VDDQ
DUT
DQ
DQS, DQS
RDQS, RDQS
Output
V
TT
= V
DDQ
/2
25
Test point
Figure 2 - Slew Rate Test Load
相關(guān)PDF資料
PDF描述
K4T1G044QQ-HC(L)E7 1Gb Q-die DDR2 SDRAM Specification
K4T1G044QQ-HC(L)F7 1Gb Q-die DDR2 SDRAM Specification
K4T1G084QQ 1Gb Q-die DDR2 SDRAM Specification
K4T1G084QQ-HC(L)E6 1Gb Q-die DDR2 SDRAM Specification
K4T1G084QQ-HC(L)E7 1Gb Q-die DDR2 SDRAM Specification
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
K4T1G044QQ-HCLE7 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:1Gb Q-die DDR2 SDRAM Specification
K4T1G044QQ-HCLF7 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:1Gb Q-die DDR2 SDRAM Specification
K4T1G084QAZCD5 制造商:Samsung Semiconductor 功能描述:
K4T1G084QA-ZCD5 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:1Gb A-die DDR2 SDRAM Specification
K4T1G084QA-ZCE6 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:1Gb A-die DDR2 SDRAM Specification