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| 型號(hào)： | TS8882VF20 |
| 文件頁(yè)數(shù)： | 8/42頁(yè) |
| 文件大?。?/td> | 1703K |
| 代理商： | TS8882VF20 |
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8
TS68882
2119A
–
12/01
Thermal
Characteristics
Power
Considerations
The average chip-junction temperature, T
J,
in
°
C can be obtained from:
T
J
= T
A
+ (P
D
+
θ
JA
)
T
A
= Ambient Temperature,
°
C
θ
JA
= Package Thermal Resistance, Junction-to-Ambient,
°
C/W
P
D
= P
INT
+ P
I/O
P
INT
= I
CC
x V
CC,
Watts - Chip Internal Power
P
I/O
= Power Dissipation on Input and Output Pins - User Determined
For most applications P
I/O
< P
INT
and can be neglected.
An Approximate relationship between P
D
and T
J
(if P
I/O
is neglected) is:
P
D
= K: (T
J
+ 273)
Solving equations (1) and (2) for K gives
(1)
(2)
K = P
D
. (T
A
+ 273) +
θ
JA
·
P
D
where K is constant pertaining to the particular part K can be determined from the equation (3)
by measuring PD (at equilibrium) for a known T
A
. Using this value of K, the values of P
D
and T
J
can be obtained by solving equations (1) and (2) iteratively for any value of T
A
.
The total thermal resistance of a package (
θ
JA
) can be separated into two components,
θ
JC
and
θ
CA
, representing the barrier to heat flow from the semiconductor junction to the package
(case), surface (
θ
JC
) and from the case to the outside ambient (
θ
CA
). These terms are related
by the equation:
2
(3)
θ
JA
=
θ
JC
+
θ
CA
θ
JA
is device related and cannot be influenced by the user. However,
θ
CA
is user dependent
and can be minimized by such thermal management techniques as heat sinks, ambient air
cooling and thermal convection. Thus, good thermal management on the part of the user can
significantly reduce
θ
CA
so that
θ
JA
approximately equals
θ
JC.
Substitution of
θ
JC
for
θ
JA
in
equation (1) will result in a lower semiconductor junction temperature.
(4)
Table 4.
Package
Symbol
Parameter
Value
Rating
PGA 68
θ
JA
θ
JC
θ
JA
θ
JC
Thermal Resistance - Ceramic Junction To Ambient
33
°
C/W
Thermal Resistance - Ceramic Junction To Case
4
°
C/W
CQFP
Thermal Resistance - Ceramic Junction To Ambient
33
°
C/W
Thermal Resistance - Ceramic Junction To Case
3
°
C/W
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