參數(shù)資料
型號： XC6SLX100T-2FG484I
廠商： Xilinx Inc
文件頁數(shù)： 29/89頁
文件大?。?/td> 0K
描述： IC FPGA SPARTAN 6 484FGGBGA
標(biāo)準(zhǔn)包裝： 60
系列： Spartan® 6 LXT
LAB/CLB數(shù)： 7911
邏輯元件/單元數(shù)： 101261
RAM 位總計： 4939776
輸入/輸出數(shù)： 296
電源電壓： 1.14 V ~ 1.26 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 484-BBGA
供應(yīng)商設(shè)備封裝： 484-FBGA
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.0) October 17, 2011
Product Specification
35
Output Delay Measurements
Output delays are measured using a Tektronix P6245
TDS500/600 probe (< 1 pF) across approximately 4" of FR4
microstrip trace. Standard termination was used for all
testing. The propagation delay of the 4" trace is
characterized separately and subtracted from the final
measurement, and is therefore not included in the
generalized test setups shown in Figure 4 and Figure 5.
Measurements and test conditions are reflected in the IBIS
models except where the IBIS format precludes it.
Parameters VREF, RREF, CREF, and VMEAS fully describe
the test conditions for each I/O standard. The most accurate
prediction of propagation delay in any given application can
be obtained through IBIS simulation, using the following
method:
1.
Simulate the output driver of choice into the generalized
test setup, using values from Table 32.
2.
Record the time to VMEAS.
3.
Simulate the output driver of choice into the actual PCB
trace and load, using the appropriate IBIS model or
capacitance value to represent the load.
4.
Record the time to VMEAS.
5.
Compare the results of steps 2 and 4. The increase or
decrease in delay yields the actual propagation delay of
the PCB trace.
X-Ref Target - Figure 4
Figure 4: Single-Ended Test Setup
VREF
RREF
VMEAS
(voltage level when taking
delay measurement)
CREF
(probe capacitance)
FPGA Output
ds162_06_011309
X-Ref Target - Figure 5
Figure 5: Differential Test Setup
RREF VMEAS
+
–
CREF
FPGA Output
ds162_07_011309
Table 32: Output Delay Measurement Methodology
Description
I/O Standard
Attribute
RREF
(
)
CREF(1)
(pF)
VMEAS
(V)
VREF
(V)
LVTTL (Low-Voltage Transistor-Transistor Logic)
LVTTL (all)
1M
0
1.4
0
LVCMOS (Low-Voltage CMOS), 3.3V
LVCMOS33
1M
0
1.65
0
LVCMOS, 2.5V
LVCMOS25
1M
0
1.25
0
LVCMOS, 1.8V
LVCMOS18
1M
0
0.9
0
LVCMOS, 1.5V
LVCMOS15
1M
0
0.75
0
LVCMOS, 1.2V
LVCMOS12
1M
0
0.6
0
PCI (Peripheral Component Interface)
33 MHz and 66 MHz, 3.3V
PCI33_3, PCI66_3 (rising edge)
25
10(2)
0.94
0
PCI33_3, PCI66_3 (falling edge)
25
10(2)
2.03
3.3
HSTL (High-Speed Transceiver Logic), Class I
HSTL_I
50
0
VREF
0.75
HSTL, Class II
HSTL_II
25
0
VREF
0.75
HSTL, Class III
HSTL_III
50
0
0.9
1.5
HSTL, Class I, 1.8V
HSTL_I_18
50
0
VREF
0.9
HSTL, Class II, 1.8V
HSTL_II_18
25
0
VREF
0.9
HSTL, Class III, 1.8V
HSTL_III_18
50
0
1.1
1.8
SSTL (Stub Series Terminated Logic), Class I, 1.8V
SSTL18_I
50
0
VREF
0.9
SSTL, Class II, 1.8V
SSTL18_II
25
0
VREF
0.9
SSTL, Class I, 2.5V
SSTL2_I
50
0
VREF
1.25
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