參數(shù)資料
型號(hào): XRT75R03DIVTR-F
廠商: Exar Corporation
文件頁(yè)數(shù): 19/135頁(yè)
文件大?。?/td> 0K
描述: IC LIU E3/DS3/STS-1 3CH 128LQFP
標(biāo)準(zhǔn)包裝: 750
類(lèi)型: 線路接口裝置(LIU)
驅(qū)動(dòng)器/接收器數(shù): 3/3
規(guī)程: DS3,E3,STS-1
電源電壓: 3.135 V ~ 3.465 V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 128-LQFP
供應(yīng)商設(shè)備封裝: 128-LQFP(14x20)
包裝: 帶卷 (TR)
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)當(dāng)前第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)
XRT75R03D
111
REV. 1.0.4
THREE CHANNEL E3/DS3/STS-1 LINE
In this application, these Mapper devices can be thought of as multi-channel devices. For example, an STS-3
Mapper can be viewed as a 3-Channel DS3/STS-1 to STS-3 Mapper IC. Similarly, an STS-12 Mapper can be
viewed as a 12-Channel DS3/STS-1 to STS-12 Mapper IC. Continuing on with this line of thought, if a Mapper
IC is configured to receive an STS-N signal, and (from this STS-N signal) de-map and output N DS3 signals
(towards the DS3 facility), then it will typically do so in the following manner.
In many cases, the Mapper IC will output this DS3 signal, using both a "Data-Signal" and a "Clock-Signal".
In many cases, the Mapper IC will output the contents of an entire STS-1 data-stream via the Data-Signal.
However, as the Mapper IC output this STS-1 data-stream, it will typically supply clock pulses (via the Clock-
Signal output) coincident to whenever a DS3 bit is being output via the Data-Signal. In this case, the Mapper
IC will NOT supply a clock pulse coincident to when a TOH, POH, or any "non-DS3 data-bit" is being output
via the "Data-Signal".
Now, since the Mapper IC will output the entire STS-1 data stream (via the Data-Signal), the output Clock-
Signal will be of the form such that it has a period of 19.3ns (e.g., a 51.84MHz clock signal). However, the
Mapper IC will still generate approximately 44,736,000 clock pulses during any given one second period.
Hence, the clock signal that is output from the Mapper IC will be a horribly gapped 44.736MHz clock signal.
One can view such a clock signal as being a very-jittery 44.736MHz clock signal. This jitter that exists within
the "Clock-Signal" is referred to as "Clock-Gapping" Jitter. A more detailed discussion on how the user must
handle this type of jitter is presented in “Section 10.8.2, Recommendations on Pre-Processing the Gapped
Clocks (from the Mapper/ASIC Device) prior to routing this DS3 Clock and Data-Signals to the Transmit
Inputs of the XRT75R03D” on page 123
.
10.5
A Review of the Category I Intrinsic Jitter Requirements (per Telcordia GR-253-CORE) for DS3
applications
The "Category I Intrinsic Jitter Requirements" per Telcordia GR-253-CORE (for DS3 applications) mandates
that the user perform a large series of tests against certain specified "Scenarios". These "Scenarios" and their
corresponding requirements is summarized in Table 31, below.
TABLE 31: SUMMARY OF "CATEGORY I INTRINSIC JITTER REQUIREMENT PER TELCORDIA GR-253-CORE, FOR DS3
APPLICATIONS
SCENARIO
DESCRIPTION
SCENARIO
NUMBER
TELCORDIA GR-253-CORE
CATEGORY I INTRINSIC
JITTER REQUIREMENTS
COMMENTS
DS3 De-Mapping
Jitter
0.4UI-pp
Includes effects of De-Mapping and Clock Gapping Jit-
ter
Single Pointer
Adjustment
A1
0.3UI-pp + Ao
Includes effects of Jitter from Clock-Gapping, De-Map-
ping and Pointer Adjustments.NOTE: Ao is the amount
of intrinsic jitter that was measured during the "DS3 De-
Mapping Jitter" phase of the Test.
Pointer Bursts
A2
1.3UI-pp
Includes effects of Jitter from Clock-Gapping, De-Map-
ping and Pointer Adjustments.
Phase Transients
A3
1.2UI-pp
Includes effects of Jitter from Clock-Gapping, De-Map-
ping and Pointer Adjustments.
87-3 Pattern
A4
1.0UI-pp
Includes effects of Jitter from Clock-Gapping, De-Map-
ping and Pointer Adjustments.
87-3 Add
A5
1.3UI-pp
Includes effects of Jitter from Clock-Gapping, De-Map-
ping and Pointer Adjustments.
87-3 Cancel
A5
1.3UI-pp
Includes effects of Jitter from Clock-Gapping, De-Map-
ping and Pointer Adjustments.
相關(guān)PDF資料
PDF描述
VE-J3K-MX-S CONVERTER MOD DC/DC 40V 75W
VE-J3B-MX-S CONVERTER MOD DC/DC 95V 75W
VI-B6N-IV-F4 CONVERTER MOD DC/DC 18.5V 150W
VI-B6N-IV-F2 CONVERTER MOD DC/DC 18.5V 150W
ISL267440IUZ IC INTERFACE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XRT75R03ES 功能描述:時(shí)鐘合成器/抖動(dòng)清除器 3CH T3/E3/STS1LIU+JA 3.3V W/REDUNDANCY RoHS:否 制造商:Skyworks Solutions, Inc. 輸出端數(shù)量: 輸出電平: 最大輸出頻率: 輸入電平: 最大輸入頻率:6.1 GHz 電源電壓-最大:3.3 V 電源電壓-最小:2.7 V 封裝 / 箱體:TSSOP-28 封裝:Reel
XRT75R03IV 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI 3CHNNEL E3/DS3/STS 1 JITTER ATTENUATOR RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray
XRT75R03IV-F 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI 3-Ch E3/DS3/STS-1 RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray
XRT75R03IVTR 功能描述:時(shí)鐘合成器/抖動(dòng)清除器 3CHNNEL E3/DS3/STS 1 JITTER ATTENUATOR RoHS:否 制造商:Skyworks Solutions, Inc. 輸出端數(shù)量: 輸出電平: 最大輸出頻率: 輸入電平: 最大輸入頻率:6.1 GHz 電源電壓-最大:3.3 V 電源電壓-最小:2.7 V 封裝 / 箱體:TSSOP-28 封裝:Reel
XRT75R03IVTR-F 功能描述:時(shí)鐘合成器/抖動(dòng)清除器 RoHS:否 制造商:Skyworks Solutions, Inc. 輸出端數(shù)量: 輸出電平: 最大輸出頻率: 輸入電平: 最大輸入頻率:6.1 GHz 電源電壓-最大:3.3 V 電源電壓-最小:2.7 V 封裝 / 箱體:TSSOP-28 封裝:Reel