T
參數(shù)資料
型號(hào): ADSP-TS203SABPZ050
廠商: Analog Devices Inc
文件頁數(shù): 32/48頁
文件大?。?/td> 0K
描述: IC PROCESSOR 500MHZ 576BGA
標(biāo)準(zhǔn)包裝: 1
系列: TigerSHARC®
類型: 定點(diǎn)/浮點(diǎn)
接口: 主機(jī)接口,連接端口,多處理器
時(shí)鐘速率: 500MHz
非易失內(nèi)存: 外部
芯片上RAM: 512kB
電壓 - 輸入/輸出: 2.50V
電壓 - 核心: 1.05V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 576-BBGA 裸露焊盤
供應(yīng)商設(shè)備封裝: 576-BGA-ED(25x25)
包裝: 托盤
Rev. D
|
Page 38 of 48
|
May 2012
ENVIRONMENTAL CONDITIONS
The ADSP-TS203S processor is rated for performance under
TCASE environmental conditions specified in the Operating
Thermal Characteristics
The ADSP-TS203S processor is packaged in a 25 mm
× 25 mm,
thermally enhanced ball grid array (BGA_ED). The processor is
specified for a case temperature (TCASE). To ensure that the
TCASE data sheet specification is not exceeded, a heat sink
and/or an air flow source may be required. Table 34 shows the
thermal characteristics of the BGA_ED package. All parameters
are based on a JESD51-9 four-layer 2s2p board. All data are
based on 3 W power dissipation.
Figure 41. Typical Output Rise and Fall Time (10% to 90%, VDD_IO =2.5 V)
vs. Load Capacitance at Strength 6
Figure 42. Typical Output Rise and Fall Time (10% to 90%, VDD_IO =2.5 V)
vs. Load Capacitance at Strength 7
R
IS
E
A
N
D
F
A
L
T
IM
E
S
(n
s
)
LOAD CAPACITANCE (pF)
0
10
20
30
40
50
60
70
80
90
100
0
5
10
15
20
25
RISE TIME
Y = 0.0377
x +0.7449
FALL TIME
Y = 0.0374x + 0.851
STRENGTH 6
(VDD_IO =2.5V)
R
IS
E
A
N
D
F
A
L
T
IM
E
S
(n
s
)
LOAD CAPACITANCE (pF)
0
10
20
30
40
50
60
70
80
90
100
0
5
10
15
20
25
STRENGTH 7
(VDD_IO =2.5V)
RISE TIME
Y = 0.0321
x +0.6512
FALL TIME
Y = 0.0313x + 0.818
Figure 43. Typical Output Valid (VDD_IO = 2.5 V) vs. Load Capacitance at
Max Case Temperature and Strength 0 to 71
1 The line equations for the output valid vs. load capacitance are:
Strength 0: y = 0.0956x + 3.5662
Strength 1: y = 0.0523x + 3.2144
Strength 2: y = 0.0433x + 3.1319
Strength 3: y = 0.0391x + 2.9675
Strength 4: y = 0.0393x + 2.7653
Strength 5: y = 0.0373x + 2.6515
Strength 6: y = 0.0379x + 2.1206
Strength 7: y = 0.0399x + 1.9080
Table 34. Thermal Characteristics
Parameter
Condition
Typical
Unit
θJA
1
1 θJA measured per JEDEC standard JESD51-6.
Airflow = 0 m/s
12.92
2 θJA = 12.9°C/W for 0 m/s is for vertically mounted boards. For horizontally
mounted boards, use 17.0°C/W for 0 m/s.
°C/W
Airflow = 1 m/s
10.2
°C/W
Airflow = 2 m/s
9.0
°C/W
Airflow = 3 m/s
8.0
°C/W
θJB
3
3 θJB measured per JEDEC standard JESD51-9.
—7.7
°C/W
θJC
4
4 θJC measured by cold plate test method (no approved JEDEC standard).
—0.7
°C/W
0
102030
405060
708090
100
0
5
10
15
O
U
T
P
U
T
V
A
L
ID
(n
s
)
LOAD CAPACITANCE (pF)
1
2
3
4
5
6
7
STRENGTH 0–7
(VDD_IO =2.5V)
0
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