參數(shù)資料
型號: pentium II cpu
廠商: Intel Corp.
英文描述: Pentium II Processor AT 450MHZ(工作頻率450兆赫茲奔II處理器)
中文描述: 奔騰II處理器在450MHz(工作頻率450兆赫茲奔二處理器)
文件頁數(shù): 3/84頁
文件大?。?/td> 1092K
代理商: PENTIUM II CPU
Datasheet
3
Pentium
II
Processor at 350 MHz, 400 MHz, and 450 MHz
Contents
1.0
Introduction.........................................................................................................................7
1.1
Terminology...........................................................................................................8
1.1.1
S.E.C. Cartridge Terminology ..................................................................8
1.2
References............................................................................................................9
2.0
Electrical Specifications....................................................................................................10
2.1
Processor System Bus and VREF ......................................................................10
2.2
Clock Control and Low Power States..................................................................11
2.2.1
Normal State—State 1 ...........................................................................12
2.2.2
AutoHALT Powerdown State—State 2...................................................12
2.2.3
Stop-Grant State—State 3 .....................................................................12
2.2.4
HALT/Grant Snoop State—State 4 ........................................................13
2.2.5
Sleep State—State 5..............................................................................13
2.2.6
Deep Sleep State—State 6 ....................................................................13
2.2.7
Clock Control..........................................................................................14
2.3
Power and Ground Pins ......................................................................................14
2.4
Decoupling Guidelines ........................................................................................14
2.4.1
Processor VCC
CORE
Decoupling............................................................15
2.4.2
Processor System Bus AGTL+ Decoupling............................................15
2.5
Processor System Bus Clock and Processor Clocking.......................................15
2.5.1
Mixing Processors of Different Frequencies...........................................15
2.6
Voltage Identification...........................................................................................15
2.7
Processor System Bus Unused Pins...................................................................17
2.8
Processor System Bus Signal Groups ................................................................17
2.8.1
Asynchronous vs. Synchronous for System Bus Signals.......................19
2.8.2
System Bus Frequency Select Signal (100/66#)....................................19
2.9
Test Access Port (TAP) Connection....................................................................20
2.10
Maximum Ratings................................................................................................20
2.11
Processor DC Specifications...............................................................................21
2.12
AGTL+ System Bus Specifications .....................................................................24
2.13
System Bus AC Specifications............................................................................25
3.0
System Bus Signal Simulations........................................................................................36
3.1
System Bus Clock (BCLK) Signal Quality Specifications and Measurement
Guidelines ...........................................................................................................37
3.2
AGTL+ Signal Quality Specifications and Measurement Guidelines ..................38
3.3
Non-AGTL+ Signal Quality Specifications and Measurement Guidelines...........40
3.3.1
Overshoot/Undershoot Guidelines .........................................................41
3.3.2
Ringback Specification...........................................................................41
3.3.3
Settling Limit Guideline...........................................................................42
4.0
Thermal Specifications and Design Considerations.........................................................42
4.1
Thermal Specifications........................................................................................43
4.1.1
Thermal Diode........................................................................................44
5.0
S.E.C.C. and S.E.C.C.2 Mechanical Specifications........................................................44
5.1
S.E.C.C. Mechnical Specifications......................................................................45
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