- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄369993 > pentium II processor (Intel Corp.) 32 bit processor AT 233MHZ，266MHZ，300MHZ and 333MHZ(工作頻率233，266，300和333兆赫茲32位處理器) PDF資料下載
參數(shù)資料
| 型號： | pentium II processor |
| 廠商： | Intel Corp. |
| 英文描述： | 32 bit processor AT 233MHZ，266MHZ，300MHZ and 333MHZ(工作頻率233，266，300和333兆赫茲32位處理器) |
| 中文描述： | 32位處理器，233MHZ，266MHz的的300MHz和333MHz的（工作頻率23326.63萬和333兆赫茲32位處理器） |
| 文件頁數(shù)： | 44/94頁 |
| 文件大?。?/td> | 892K |
| 代理商： | PENTIUM II PROCESSOR |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁當前第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁
PENTIUM II PROCESSOR AT 233 MHZ, 266 MHZ, 300 MHZ, AND 333 MHZ
E
44
4.2.2.
MEASUREMENTS FOR THERMAL
SPECIFICATIONS
4.2.2.1.
Thermal Plate Temperature
Measurement
To ensure functional and reliable Pentium II
processor operation, the thermal plate temperature
(T
PLATE
) must be maintained at or below the
maximum T
PLATE
temperature specified in Table 20.
Figure 19
shows
the
measurement.
location
for
T
PLATE
Special care is required when measuring T
PLATE
to
ensure an accurate temperature measurement.
Thermocouples are used to measure T
PLATE
. Before
taking
any
temperature
thermocouples must be calibrated. When measuring
the temperature of a surface, errors can be
introduced in the measurement if not handled
properly. The measurement errors can be due to a
poor thermal contact between the thermocouple
junction and the surface of the thermal plate,
measurements,
the
conduction through thermocouple leads, heat loss by
radiation and convection, or by contact between the
thermocouple cement and the heatsink base. To
minimize these errors, the following approach is
recommended:
Use 36 gauge or finer diameter K, T, or J type
thermocouples. Intel’s laboratory testing was
done using a thermocouple made by Omega*
(part number: 5TC-TTK-36-36).
Attach the thermocouple bead or junction to the
top surface of the thermal plate at the location
specified in Figure 19 using high thermal
conductivity cements.
The thermocouple should be attached at a 0°
angle if no heatsink is attached to the thermal
plate. If a heatsink is attached to the thermal
plate but the heatsink does not cover the location
specified
for
T
PLATE
thermocouple should be attached at a 0° angle
(refer to Figure 20).
measurement,
the
2.673
1.089
Measure from edge of thermal plate.
Cover
Measure T
at this point.
PLATE
Processor
Core
Substrate
All dimensions in inches.
0.35 R
Recommended location of
thermal grease application.
Approx. location for
recommended
heatsink attachment.
000874b
Figure 19. Processor Thermal Plate Temperature Measurement Location
相關PDF資料 |
PDF描述 |
|---|---|
| pentium II xeon processor | pentium II xeon processor at 400 and 450 MHZ(工作頻率400和450兆赫茲奔II處理器) |
| Pentium III cpu with mobile | Pentium III processor Mobile Module Connector 2 (MMC-2)(帶移動模塊連接器2奔III處理器) |
| pentium III CPU | Pentium III Processor for the SC242 at 450MHz to 1.0GHz(SC242工作頻率450MHZ到1GHZ奔III處理器) |
| pentium III processor | 32 bit Processor Mobile Module(32 位帶移動模塊處理器) |
| Pentium OverDrive Processor | Pentium OverDrive Processor With MMX Technology For Pentium Processor-Based System(帶MMX技術奔騰超速轉動處理器) |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| P-ENV568K3G3 | 制造商:Panasonic Industrial Company 功能描述:TUNER |
| PEO14012 | 制造商:TE Connectivity 功能描述:RELAY SPCO 12VDC |
| PEO14024 | 制造商:TE Connectivity 功能描述:RELAY SPCO 24VDC |
| PEO96742 | 制造商:Delphi Corporation 功能描述:ASM TERM |
| PEOODO3A | 制造商:MACOM 制造商全稱:Tyco Electronics 功能描述:Versatile Power Entry Module with Small Footprint |
發(fā)布緊急采購，3分鐘左右您將得到回復。