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| 型號(hào)： | pentium II processor |
| 廠商： | Intel Corp. |
| 英文描述： | 32 bit processor AT 233MHZ，266MHZ，300MHZ and 333MHZ(工作頻率233，266，300和333兆赫茲32位處理器) |
| 中文描述： | 32位處理器，233MHZ，266MHz的的300MHz和333MHz的（工作頻率23326.63萬和333兆赫茲32位處理器） |
| 文件頁數(shù)： | 45/94頁 |
| 文件大小： | 892K |
| 代理商： | PENTIUM II PROCESSOR |
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E
PENTIUM II PROCESSOR AT 233 MHZ, 266 MHZ, 300 MHZ, AND 333 MHZ
45
000899
Figure 20. Technique for Measuring T
PLATE
with 0° Angle Attachment
000900
Figure 21. Technique for Measuring T
PLATE
with 90° Angle Attachment
The thermocouple should be attached at a 90°
angle if a heatsink is attached to the thermal
plate and the heatsink covers the location
specified for T
PLATE
measurement (refer to
Figure 21).
The hole size through the heatsink base to route
the thermocouple wires out should be smaller
than 0.150" in diameter.
Make sure there is no contact between the
thermocouple cement and heatsink base. This
contact will affect the thermocouple reading.
4.2.2.2.
Cover Temperature Measurement
The maximum and minimum S.E.C. cartridge cover
temperature (T
COVER
) for the Pentium II processor is
specified in Table 20. This temperature specification
is meant to ensure correct and reliable operation of
the processor. Figure 22 illustrates the hottest points
on the S.E.C. cartridge cover. T
COVER
thermal
measurements should be made at these points.
4.3.
Thermal Solution Attach
Methods
The design of the thermal plate is intended to support
two different attach methods — heatsink clips and
Rivscrews*. Figure 41 shows the thermal plate and
the locations of the attach features. Only one attach
method should be used for any thermal solution.
4.3.1.
HEATSINK CLIP ATTACH
Figure 23 and Figure 24 illustrate example clip
designs to support a low profile and a full height
heatsink, respectively. The clips attach the heatsink
by engaging with the underside of the thermal plate.
The clearance of the thermal plate to the internal
processor substrate is a minimum 0.124" (illustrated
in Figure 23 and Figure 24). The clips should be
designed such that they will engage within this
space, and also not damage the substrate upon
insertion or removal. Finally, the clips should be able
to retain the heatsink onto the thermal plate through a
system level mechanical shock and vibration test.
The clips should also apply a high enough force to
spread the interface material for the spot size
selected.
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